- Siemens and Foxconn sign memorandum of understanding (MoU), highlighting joint sustainability commitment - Cooperation to define standards for the factory of the future and for manufacturing processes - Innovations to positively impact information and communications technology and electric-vehicle production ecosystems  - Siemens Xcelerator portfolio to optimize Foxconn’s operations for efficiency and agility Siemens AG, a leading technology company, and Hon Hai Technology Group (Foxconn) (TWSE:2317), the world’s largest electronics manufacturer, have signed a memorandum of understanding (MoU) to drive digital transformation and sustainability in smart manufacturing platforms.  The collaboration focuses on global manufacturing processes in electronics, information and communications technology, and electric vehicles (EV). Siemens and Foxconn are working together to establish a scalable and seamless engineering and manufacturing ecosystem. Roland Busch, President and CEO of Siemens AG, emphasized the significance of this partnership: “At Siemens, we believe in the power of partnerships to drive positive change. Our collaboration with Foxconn underscores our commitment to innovation and sustainability as we work together to shape the future of electronics manufacturing.” Young Liu, Chairman and CEO of Hon Hai Technology Group (Foxconn), said: “Foxconn is transforming into a platform solutions provider for smart manufacturing, smart EVs and smart cities. Joining forces with Siemens accelerates our digital transformation journey and opens up new possibilities for innovation and sustainability.” This MoU identifies key collaboration areas to increase the automation level at Foxconn’s facilities. These areas include electronics manufacturing service (EMS) and contract design and manufacturing service (CDMS), which is Foxconn’s innovative business model for electric vehicles. Both companies will explore initiatives to work toward the factory of the future by implementing Siemens’ leading factory automation portfolio and industrial software, which include building blocks such as digital twin technology and artificial intelligence (AI). Siemens Xcelerator, with its comprehensive suite of software and solutions, will play a pivotal role in optimizing Foxconn’s engineering and manufacturing workflows, facilitating efficiency and agility across its operations. This collaboration aims to leverage how Siemens’ technical expertise can enhance Foxconn’s sustainability performance, contributing to energy savings and a reduced CO2 footprint. This partnership involves establishing transparent monitoring processes and applying professional services and digital solutions because both companies are working toward a greener future for electronics manufacturing. “Electronics are the backbone of modern society, powering everything from communication to transportation. We are, therefore, very proud to intensify our collaboration with Foxconn,” said Cedrik Neike, CEO of Digital Industries and member of the Managing Board of Siemens AG. “With Siemens’ domain knowhow and leading portfolio in factory automation and software, we’ll accelerate the transformation of the electronics manufacturing industry and support Foxconn to not only achieve its sustainability targets, but also improve efficiency.”  Dr. Zhe Shi, Foxconn’s Chief Digital Officer and head of its Smart Manufacturing platform, added: “Siemens is a leader in providing digital transformation solutions. Our deepening collaboration to build the factory of the future in the AI era will enable us to provide topflight manufacturing service to all our customers.” 

*As of April 30, 2024, Foxconn acquires 50 percent of the shares in ZF Chassis Modules GmbH *Strategic partnership strengthens mutual cooperation, business growth and expansion of the customer base  *Partners explore further fields of innovation   01.05.2024 Friedrichshafen/Taipei. ZF Friedrichshafen AG, one of the world's largest automotive suppliers, and Hon Hai Technology Group ("Foxconn", TWSE: 2317), the world's largest electronics manufacturer, have completed the establishment of their joint venture in the field of passenger car chassis systems on April 30. The acquisition of a 50-percent stake in ZF Chassis Modules GmbH by Foxconn achieves a 50-50 partnership, which was agreed upon on July 24, 2023, and approved by regulators. The new joint venture, called ZF Foxconn Chassis Modules, is a central element in the future strategy of both shareholders. Through the partnership, ZF Friedrichshafen AG secures resources for profitable growth, new customer access and additional development fields beyond the growing core market of axle system assembly. For Foxconn, the acquisition of a 50-percent stake in ZF Chassis Modules GmbH, with a total enterprise value of around €1 billion (around $1.1 billion), opens up new perspectives in the automotive sector. The joint venture will use core competencies and process expertise from existing business areas and jointly develop them for new markets.     "ZF and Foxconn complement each other perfectly in this joint venture," affirms Dr. Holger Klein, Chairman of the Board of Management of ZF Friedrichshafen AG. "It uniquely combines engineering competence, agility, know-how and customer orientation on a global scale. This secures our presence in today’s growth segments and paves the way to engage in future markets. Together, we will meet the needs of existing and new customers in an even more targeted manner and bring innovative technologies to series production."     "I am very pleased about the partnership that has been sealed today. Foxconn's global network and supply chain management expertise will have a positive impact on the growth strategies of our two companies," said Young Liu, Chairman and CEO of Foxconn. "We are very interested in opening up further partnership opportunities in the transportation and mobility sector with ZF Foxconn Chassis Modules."    The joint venture, which is headed by the two experienced ZF executives Eike Dorff (CEO) and Urs Rienhoff (CFO), strives to take advantage of expansion opportunities in the global market for axle system assembly. It aims to achieve the greatest possible adaptation to markets and contractual partners through continuous process optimization. The enterprise value of the ZF division is around €1 billion (around $1.1 billion). ZF Foxconn Chassis Modules GmbH supplies global premium and volume manufacturers and is represented at 25 locations worldwide. The company employs approximately 3,800 people, almost 100 of whom are based in Germany. The division's sales for 2023 amounted to roughly €4.3 billion ($4.7 billion).  Dr. Holger Klein, Chairman of the Board of Management of ZF Friedrichshafen AG (left), and Young Liu, Chairman and CEO of Hon Hai Technology Group (Foxconn), with the brand logo of the new joint venture ZF Foxconn Chassis Modules.  Picture credits: ZF  About ZF  ZF is a global technology company supplying advanced mobility products and systems for passenger cars, commercial vehicles and industrial technology. Its comprehensive product range is primarily aimed at vehicle manufacturers, mobility providers and start-up companies in the fields of transportation and mobility. ZF electrifies a wide range of vehicle types. With its products, the company contributes to reducing emissions, protecting the climate as well as enhancing safe mobility. Alongside the automotive sector – passenger cars and commercial vehicles – ZF also serves market segments such as construction and agricultural machinery, wind power, marine propulsion, rail drives and test systems. With some 168,700 employees worldwide, ZF reported sales of €46.6 billion in fiscal 2023. The company operates 162 production locations in 31 countries. Please find more information on: www.zf.com

Foxconn’s Investment helps Indigo accelerate its breakthrough Smart EVs with superior user experiences and sustainable unit economics for fleets, businesses and transportation companies Boston, MA --(BUSINESS WIRE)— March 25, 2024— Indigo Technologies, a robotics focused Smart EV OEM with breakthrough road sensing SmartWheels™ invented by team out of MIT, today announced it has received a strategic investment from Hon Hai Technology Group (Foxconn). The investment, which recently gained regulatory approval after being first announced late last year, accelerates Indigo, the US automotive tech innovator in its development of smart, smooth and efficient light utility EVs designed for sustainable ride hail, delivery and autonomous transportation services. Indigo EVs will help transportation network companies (TNC) and delivery network companies (DNC), fleet management companies (FMC) and the millions of businesses, taxi drivers and gig economy work force to become more profitable while driving to a more sustainable future. “Our cities, citizens and businesses need affordable and desirable EVs that improve safety, utility and comfort,” says Will Graylin, CEO of Indigo. “We are thrilled to be partnering with Foxconn on the mission to create technology for smart living and deliver the next generation of lighter, more cost effective EVs for sustainable mobility at scale. Foxconn’s Chief Strategy Officer for Electric Vehicles Mr. Jun Seki, who was former CEO of Nidec and COO of Nissan, joins Indigo’s Board of Directors adding further innovation depth and global supply chain connections as we launch vehicles in 2025”. According to Foxconn, this will support the vision to turn an MIT invention into a global innovation with commercial adoption.  Partnered with the largest TNCs, DNCs and FMCs, Indigo’s EV software and hardware solutions with TaaS Transport-as-a-Service package will include fleet transport operations and manage autonomous fleet mobility on public roads. Indigo invented the world’s only road sensing SmartWheels™, robotics hardware and software that fully integrates drivetrain and suspension as a tech package, to enable a whole new vehicle architecture, making lighter, more efficient EVs feel incredibly smooth and stable, yet more roomy and affordable. Indigo first SmartWheels™ powered EVs, the FLOW, will have more usable cabin space, a lower flat floor, a smoother ride experience and better unit economics than any vehicle of its class. The FLOW will have 180 cubic feet of space, approximately 200 miles of range, priced near $37K and is expected to hit the roads of America late 2026. Indigo will also deliver a smaller Smart EV called the DASH with the latest telematics and sensors connected to its cloud software to help fleets lower risks and total-cost-of-ownership while improving service experiences. The DASH will have 90 cubic feet of space, 140 miles of range, priced near $27K and will be in trial 2H 2024, with volume delivery early 2025.  About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking in the top 30 among the Fortune Global 500. In 2023, revenue totaled TWD6.162 trillion (approx. USD198 billion or EUR183 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and others. The Group operates 205 campuses across 24 countries and is one of the world’s largest employers with over a million employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – next-generation communications technology, AI, and semiconductors – which are key to driving its long-term growth strategy. It is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practices model for global enterprises. To learn more, visit www.honhai.com     About Indigo Tech Indigo is the only Smart EV OEM with patented road sensing robotic SmartWheels™ EVs with roomier, smoother and safer rides for people and fleets at a price they can afford. We are building a whole new class of ultra-efficient EVs designed from the wheels up focused on user experience and unit economics. Indigo Smart EVs are designed first for ride hail and delivery applications, and will expand later towards consumer Smart EVs with possibilities to license its technology to other OEMs.  Indigo SmartWheels™ powered EVs will have the largest interior space, smoothest and best ride quality, and lowest cost-per-mile of any vehicle in its class.        Indigo is working with fleets, TNCs, DNCs and Transportation-as-a-Service (TaaS) companies, to proliferate sustainable, desirable and affordable transportation for all. www.indigotech.com

What’s new: NXP® Semiconductors and Hon Hai Technology Group (“Foxconn”) today opened a joint laboratory in the Foxconn Nankan Facility in Taiwan, marking a new milestone in the companies’ strategic collaboration for software-defined electric vehicle development. The joint lab aims to accelerate Foxconn’s efforts in software-defined, electric vehicles, leveraging NXP’s comprehensive electrification portfolio and cross-vehicle system solutions using the S32G and S32K3 families for domain and zonal controllers targeting service-oriented gateways, vehicle networking and safe vehicle control. Why it matters: According to McKinsey & Company, the global automotive software and electronics market is expected to reach $462 billion by 2030, representing a 5.5 percent compound annual growth rate (CAGR) since 2019. The way vehicles are architected, designed, manufactured and experienced is being transformed by software, but this transformation will be an industry-wide effort, requiring close collaboration between diverse stakeholders. The joint laboratory in Taoyuan is a significant example of this team effort. It benefits from bringing together Foxconn’s deep knowledge and experience in electronics manufacturing with NXP’s longstanding expertise in safe and secure system solutions to enable architectural innovation and platforms for electrification, connectivity, and safe automated driving. Together, the companies aim to accelerate the development time for software-defined electric vehicles. More details: In July 2022, NXP announced that it had signed a memorandum of understanding with Foxconn to jointly develop platforms for a new generation of smart connected vehicles, aiming to leverage NXP’s portfolio of automotive technologies. The joint laboratory in Foxconn’s Nankan facility will be the primary location for innovation, discussion, training and enabling new applications. The collaborative lab brings together more than 200 engineers based locally and abroad from both Foxconn and NXP.  “Foxconn sees the disruptive challenges and the potential for innovation in today’s automotive industry. NXP’s longstanding expertise and leadership in the automotive sector, system understanding, innovative products and laser focus on safety, security and quality provide the foundation for the collaboration we are strengthening today,” said Zeke Wu, EV E/EA R&D Director, Foxconn E-Business Group. ”The joint lab is a significant milestone in the strategic partnership between Foxconn and NXP and we anticipate the results will be adopted in Foxconn’s future developments.” Elton Tsang, Senior Sales Director of NXP Semiconductors Taiwan commented: “We are proud to see the strategic collaboration has moved to the next milestone with the establishment of a joint lab with Foxconn today. The lab will accelerate the progress of electric, software-defined vehicles from talk to reality. The auto industry has to become faster and more efficient, and NXP is pleased to extend its system solutions portfolio to enable electrification, next generation architectures, smart and secure car access systems, and more.”

Partners NVIDIA and ZF Group on stage highlight forward-looking technologies   In 3 years, full range of EV manufacturing capabilities on display Family SUV to hit roads in 2024, while sporty crossover to enter mass production Both CSOs take to HHTD23 stage for first time on EVs and semiconductors   18 October 2023, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE: 2317) unveiled its exceptional, practical and cutting-edge electric cargo van on Wednesday, part of on an unprecedented line-up of technologies showcasing the contract design and manufacturing service (CDMS) of the world’s largest technology manufacturer and service provider. At the same time, Foxconn signaled mass production plans for a sporty and intelligent crossover, the MODEL B; provided an update on the commercial production of its first family SUV, the MODEL C; and disclosed the imminent launch of its first self-developed prototype low-Earth-orbit satellite. At its 4th annual Hon Hai Tech Day (“HHTD23”), Foxconn Chairman and CEO Young Liu said, “With the new MODEL N electric cargo van, we demonstrate a full range of vertically integrated capabilities. Traditional automotive companies can tap into all of these. In three short years, Foxconn has displayed a remarkable range of high-end sedan, passenger crossover, SUV, compact pick-up, commercial bus and commercial van.” According to Foxconn Chief Strategy Officer for EVs, Jun Seki, Foxconn currently has about 14 potential customers it is in touch with and 23 development projects are being carried out. He reinforced the idea of accelerated development for EVs based on modular components in the supply chain and a platform-based development strategy. India and Japan should be the next great potential for EV development. A vertically integrated supply chain, but particularly in the semiconductor segment, underpins Foxconn’s resilience in its EV efforts, said Foxconn Chief Strategy Officer Shang-yi Chiang. Moreover, the "System Foundry Business Model", which can meet the diverse semiconductor demand of the IoT market, will be able to effectively save manpower, reduce capital investment, and shorten chip time to market. Both CSOs took to the stage for the first time at Foxconn’s flagship event adding to substantive insights on electromobility. HHTD23 was the biggest one to date with more than 1,000 attendees and as two of Foxconn’s global partners also shared the stage for the first time: US chipmaker NVIDIA and German automotive supplier ZF Group. Each brought fresh perspectives in the areas of AI and new generation mobility. NVIDIA Founder and CEO Jensen Huang, who appeared on stage with Chairman Liu in a MODEL B, said, “A new type of manufacturing has emerged – the production of intelligence, and the data centers that produce them are AI factories. Foxconn, the world’s largest manufacturer, has the expertise and scale to build AI factories globally. We are delighted to expand our decade long partnership with Foxconn to accelerate the AI industrial revolution.”  Towards deepening the collaboration of the two companies: Foxconn Smart EV will be built on NVIDIA DRIVE Hyperion 9, NVIDIA’s next-gen platform for autonomous automotive fleets, powered by NVIDIA DRIVE Thor, its future automotive SoC. Foxconn Smart Manufacturing robotic systems will be built on NVIDIA Isaac AMR autonomous mobile robot platform. Foxconn Smart City will incorporate NVIDIA Metropolis intelligent video analytics platform. E-mobility and advanced chassis solutions are the core technologies of German automotive supplier giant ZF Group. “The electric vehicle business is growing rapidly in the Asia-Pacific and global markets with a promising future. ZF is at the forefront of e-mobility innovations with class-leading solutions and partnerships,” said ZF Group CEO Holger Klein, who was in Taipei for HHTD23, his first visit since Foxconn and ZF announced a 50-50 partnership in July. “In the future, the two companies will make full use of each other's capabilities to expand their product range in both internal combustion engine (ICE) and electric vehicles. ZF Group has been operating in Taiwan since 1988, and our business partnership with Hon Hai will further strengthen our presence in the Asia-Pacific region and globally as we move towards Next Generation Mobility.”  New logistics EV The MODEL N complements Foxconn’s remarkable stable of electric vehicles solutions, providing more choices for automakers preparing to enter the electric era. MODEL N subverts the image of traditional vans with innovative thinking, combines the concept of sustainable environmental protection promoted by the new energy generation, and has more humanized and considerate designs. Its clean lines and roomy build support safety first with a “tap and unload” one-button design that activates automatic flipping cargo compartment boarding steps, safety warning projection lights on both sides and rear, and the opening of the electric rear rolling door. The overall design makes the driver safer and more comfortable when transporting cargo. Its efficiency is expected to bring a new transportation experience to logistics operators. The MODEL B, following its unveiling last year, has been well received. The design of the mass-produced version retains the most popular technological simplicity and aerodynamic styling. It adopts a new generation of centralized EEA architecture, which will be able to support more functional smart cockpits or intelligent control driving modes. It can also be equipped with 15.6-inch IVI (in-vehicle infotainment), electronic digital rearview mirrors, and Matrix LED smart headlights and UWB (ultra-wideband communication technology) digital keys. Automakers and customers can choose and match according to market demand. The MODEL C has completed a number of verifications, such as: durability test, water immersion test, climbing/high-speed performance test, and has also completed winter/summer experiments in the United States. In addition, Foxconn will also provide performance and extended range versions of the MODEL C, giving brand customers a selection to choose from based on power, endurance and speed. The first passenger electric SUV made under Foxconn’s CDMS business model received an official license plate in Taiwan, a recent milestone, showing it meets the four major categories of safety, pollution, noise, and energy consumption tests specified by the competent authority, and can be officially put on the road. The MODEL C has been adopted by a brand customer in Taiwan and officially launched for sale. Hon Hai will mass-produce and deliver the vehicles in November. Consumers will be able to drive them on the road in the first quarter of next year! ​​​​​​​ About Hon Hai Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking in the top 30 among the Fortune Global 500. In 2022, revenue totaled TWD6.62 trillion (approx. USD220 billion or EUR200 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and others. The Group operates 173 campuses across 24 countries and is one of the world’s largest employers with over a million employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – next-generation communications technology, AI, and semiconductors – which are key to driving its long-term growth strategy. It is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practices model for global enterprises. To learn more, visit www.honhai.com

[September 28, 2023, Paris, France / Taipei, Taiwan] Blue Solutions has signed a memorandum of understanding with Hon Hai Technology Group (Foxconn) and its subsidiary, SolidEdge Solution Inc., to jointly develop a solid-state battery ecosystem for the electric two-wheeler market. Blue Solutions is a Bolloré Group entity and global industrial-scale designer and manufacturer of solid-state batteries, which have been marketed since 2011. The company has signed a memorandum of understanding (M.O.U.) with Foxconn - the world’s largest electronics manufacturing services provider - and its subsidiary SolidEdge Solution Inc., which designs battery materials. The aim of the agreement is to jointly develop a solid-state battery ecosystem. The partners have agreed to combine their expertise, technologies, and resources to develop and produce batteries for two-wheeled vehicles. The partners’ objective is to co-develop batteries using Blue Solutions’ exclusive solid-state cell technology. Specifically, they will use Blue Solutions’ innovative Gen4 technology and SolidEdge Solution’s materials to equip two-wheeled vehicles to serve the target markets. According to the terms of the agreement, variants of these battery systems may also be adapted for other electric vehicles. The cooperation between Blue Solutions and Foxconn will initially target the Indonesian market. According to McKinsey’s estimates, the global two-wheeled vehicle market will be worth about $218 billion by 2029, with a CAGR of 8.7% and the main growth momentum will come from electric motorcycles. The country’s ultimate goal is to have the number of electric motorcycles reach 13 million by 2030, from a fraction of what it is now. As a pioneer, Blue Solutions has an extensive background in solid-state batteries with research going back in the 1980s. It is the sole producer in the world, and since 2011, of solid-state cells, modules and packs with productions lines located both in France and in Canada. At this date Bolloré group has already invested €3 Billion in Blue Solutions and its activities, leading to more than 3 million cells delivered to the market. Foxconn’s subsidiary, SolidEdge Solution, was founded in 2021 and is a pioneer in the development of battery materials in Taiwan. The goal of this innovative work is to develop common materials for each of the main components of a battery cell.   “This memorandum of understanding with Foxconn, the best-in class industrial manufacturer, is a key step in Blue Solutions’ strategy of forging strong partnerships to expand internationally. Foxconn represents a partner of choice to address together the future two-wheeler market in Asia and set up very ambitious targets for mobility.” Richard Bouveret, President and CEO of Blue Solutions   "Battery is the heart of electric vehicles, and solid-state batteries is the ultimate goal for the rapid development of electric vehicles! Foxconn and Blue Solutions hope to accelerate the development of solid-state battery solutions that meet market demand and offer prime performance for our EV customers going forward to achieve the strategic goals of time-to-cost and time-to-market." Troy Wu, Head of battery strategy at Hon Hai Technology Group (Foxconn)   About Blue Solutions Blue Solutions, a Bolloré Group entity, is a global designer and manufacturer of all-solid-state batteries, based in Ergué-Gabéric (Brittany, France) and Boucherville (Quebec, Canada). Since 2011, Blue Solutions has been the only company in the world to mass produce all-solid-state batteries based on Lithium-Metal-Polymer (LMP®) technology to meet the growing demand for sustainable, low-carbon transport. The Blue Solutions production sites have ISO 9001 and ISO 14001 certification. More information on www.blue-solutions.com   About Hon Hai Technology Group (Foxconn) Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking in the top 30 among the Fortune Global 500. In 2022, revenue totaled TWD6.62 trillion (approx. USD220 billion or EUR200 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and others. The Group operates 173 campuses across 24 countries and is one of the world’s largest employers with over a million employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – new-generation communications technology, AI, and semiconductors – which are key to driving its long-term growth strategy. It is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practices model for global enterprises. To learn more, visit www.honhai.com

•   Foxconn acquires 50-percent stake in ZF Chassis Modules GmbH •   Strategic partnership seeks to mutually grow business, expand customer base •   Partners in talks about further opportunities Friedrichshafen, Germany and Taipei, Taiwan – 24 July 2023 – ZF Friedrichshafen AG (ZF Group), one of the world’s largest automotive suppliers, and Hon Hai Technology Group (“Foxconn”) (TWSE:2317), the world’s largest electronics manufacturer, today announced a 50-50 partnership in passenger car chassis systems, a key move aimed at accelerating and expanding automotive and supply chain opportunities with top-tier customers. Foxconn will acquire a 50-percent stake in ZF Chassis Modules GmbH, a unit of ZF Group which bundles the passenger car axle systems assembly and has an enterprise value of approx. €1 billion, enabling a strategic partnership that will further grow opportunities for ZF Chassis and widen new perspectives for Foxconn in the automotive sector. The partnership will leverage each other’s capabilities and expand the range of product offerings in the internal combustion engine and especially electric vehicle (ICE/EV) space. “With Foxconn, we have gained a strong strategic partner with whom we can open up new perspectives and opportunities for the ZF Chassis Modules GmbH,” says ZF CEO Dr. Holger Klein. “ZF as a globally active automotive supplier and Foxconn as a leading electronics manufacturer complement each other excellently to jointly open new customer groups and expand its presence, especially in growing markets. With this step, we are implementing our strategy to grow specific business areas of ZF with the support of external partners beyond current limits.” “I am absolutely excited about this partnership. Foxconn’s global network and supply chain management know-how, plus the expertise, diligence, and commitment that ZF Chassis brings will result in a successful execution of value-added creation for both our shareholders,” said Foxconn Chairman and CEO Young Liu. “We are also keen to explore more partnership opportunities with the ZF Group in the broader transportation and mobility space.” The enterprise value of ZF’s business unit is approximately €1 billion or more. ZF and Foxconn expect the JV agreement to be effective within six to nine months after signing and following regulatory approvals. ZF Chassis Modules GmbH, serving global premium and volume car manufacturers, is represented at 25 locations worldwide. It has approximately 3,300 employees, of which 100 are in Germany. The business unit’s sales are expected to exceed €4 billion in 2023. About ZF ZF is a global technology company supplying systems for passenger cars, commercial vehicles and industrial technology, enabling the next generation of mobility. ZF allows vehicles to see, think and act. In the four technology domains of Vehicle Motion Control, Integrated Safety, Automated Driving, and Electric Mobility, ZF offers comprehensive product and software solutions for established vehicle manufacturers and newly emerging transport and mobility service providers. ZF electrifies a wide range of vehicle types. With its products, the company contributes to reducing emissions, protecting the climate and enhancing safe mobility. With some 165,000 employees worldwide, ZF reported sales of €43.8 billion in fiscal 2022. The company operates 168 production locations in 32 countries. About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking in the top 20 among the Fortune Global 500. In 2022, revenue totaled TWD6.62 trillion (approx. USD220 billion or EUR200 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and others. The Group operates 173 campuses across 24 countries and is one of the world’s largest employers with over a million employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – new-generation communications technology, AI, and semiconductors – which are key to driving its long-term growth strategy. It is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practices model for global enterprises. To learn more, visit www.honhai.com

July 20, 2023—Taipei, Taiwan—Analog Devices, Inc. (Nasdaq: ADI), a global semiconductor leader, and Hon Hai Technology Group (“Foxconn”) (TWSE:2317), the world’s largest electronics manufacturing services provider, are pleased to announce the completion of a Memorandum of Understanding (MoU) towards the development of the next-generation digital car cockpit and a high-performance battery management system (BMS). The signing event was officiated by Vincent Roche, CEO and Chair of ADI, and Young Liu, CEO and Chair of Foxconn. Together, the two companies are positioned to forge a transformative path by advancing software-defined and more sustainable, feature-rich vehicles, ultimately pursuing a new era of automotive excellence. “The global automotive industry continues to digitalize and differentiate at the semiconductor level to deliver a more personalized, immersive, and sustainable driving experience,” said Vincent Roche, CEO and Chair at ADI. “ADI is delighted to work together with Foxconn to create a smarter mobility ecosystem and accelerate the breakthrough innovations the industry needs. With our joint expertise, we aim to transform the automotive industry towards a future of mobility that is better for humanity and the planet." "Foxconn actively collaborates with international partners to link ecosystems and unlock greater value in electric car technology and smart transportation. We are looking forward to working with ADI to leverage its high-performance automotive electronics technology, enabling our clients to overcome obstacles and seize emerging possibilities," said Young Liu, CEO and Chair of Foxconn. ADI’s flexible hardware and robust software solutions, combined with Foxconn’s expertise in electronic design, system-level integration capabilities, and manufacturing prowess, have the potential to deliver scalable vehicle platforms to disrupt the future of automotive manufacturing and create a more enjoyable and user-friendly cockpit experience. ADI’s portfolio for automotive electrification, ADI RechargeTM, includes system-level solutions for BMS, electric powertrain, and power management to enable smarter, more efficient and longer-range EVs. Automotive cabin applications such as advanced infotainment, smart cockpits, and autonomous driving would leverage ADI A2BTM , Gigabit Multimedia Serial Link (GMSLTM) video links, and SHARC® DSP. Furthermore, ADI’s innovations in edge processing is valuable in enabling sophisticated information ecosystems in the automobile to realize the potential of software-defined vehicles. Foxconn remains steadfast in its commitment to reimagining the electric vehicle sector and propelling advancements in interconnected fields. ADI’s technology helps enable Foxconn to deliver quality and high-performance products and solutions to its end customers. Foxconn has devised a comprehensive strategy for advancing the EV industry, encompassing vehicle design, key components, global manufacturing, and efficient supply chain services. This holistic approach caters to the demands of customization and rapid product development. With ADI’s system level solutions, technology platforms, and engineering support, Foxconn can provide automotive customers access to highly competitive and cost-effective products, benefiting from vertically-integrated R&D resources and facilitating faster time-to-market (TTM). ADI's Solutions for Electrification and Automotive Cabin Experience As the world moves towards Net Zero, ADI’s electrification solutions aim to accelerate the decarbonization of transportation and the energy grid. ADI’s leadership in battery, power, and energy management is helping enable high performance, reliable, and resilient operations of the electrification ecosystem—including electric vehicles, energy storage systems, transmission/distribution, renewable energy generation, and more. Working alongside its customers, ADI is also enabling the digital cockpit and safe mobility revolution through its leadership in digital processing and data connectivity platforms. These are helping promote feature-rich applications and autonomous driving/advanced driver assistance systems (ADAS) in the vehicle. ADI’s innovations leverage precision sensing, edge processing, software and wireless technologies to deliver secure insights at the sensor edge for localized, real-time decision making. About Analog Devices, Inc. Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world. With revenue of more than $12 billion in FY22 and approximately 25,000 people globally working alongside 125,000 global customers, ADI ensures today’s innovators stay Ahead of What’s Possible. Learn more at www.analog.com and on LinkedIn and Twitter.   About Hon Hai Technology Group Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking in the top 20 among the Fortune Global 500. In 2022, revenue totaled TWD6.62 trillion (approx. USD220 billion or EUR200 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and others. The Group operates 173 campuses across 24 countries and is one of the world’s largest employers with over a million employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – new-generation communications technology, AI, and semiconductors – which are key to driving its long-term growth strategy. It is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practices model for global enterprises.To learn more, visit www.honhai.com   All trademarks and registered trademarks are the property of their respective owners.

Statement from Hon Hai Technology Group (“Foxconn”): Hon Hai Technology Group (Foxconn) (“the Company”) has been holding a positive attitude in conducting constructive negotiations with Lordstown Motors Corp (LMC) and in assisting LMC in finding a solution to its financial difficulties. However, during this time, LMC has continuously attempted to mislead the public and has been reluctant to perform the investment agreement between the two parties in accordance with its terms. Foxconn originally hoped to continue discussions and reach a solution that could satisfy all stakeholders, without resorting to baseless legal actions, but so far the two parties have yet to reach a consensus. Regarding LMC's litigation announcement today and the false comments and malicious attacks made by LMC in its external statements against Foxconn, the Company reserves the right to pursue legal actions and also suspends subsequent good faith negotiations.     鴻海科技集團聲明： 針對Lordstown Motors Corp. (LMC) 不斷試圖誤導大眾，並且不願依約履行雙方的投資協議條款一事。鴻海公司這段時間一直持正面態度與LMC 進行建設性協商，協助其解決因營運所造成的財務困境。 鴻海原希望繼續進行相關討論，盼達成各方利益關係人皆能滿意的解決方案，而不是採取毫無根據的法律行動，但截至目前雙方尚未達成共識。 對於LMC今日宣佈提告行為，以及對外聲明中，關於鴻海公司的不實評論、惡意攻擊的言論，公司將保留法律權益，鴻海也將暫緩後續的善意協商行動。

Company is the joint venture formed by Stellantis and Foxconn, leveraging both companies’ expertise and scale SiliconAuto to tailor chips aimed at new generation of automotive industry vehicle platforms, starting in 2026 AMSTERDAM, June 20, 2023 – Stellantis N.V. and Hon Hai Technology Group (“Foxconn”) (TWSE:2317) today announced the creation of SiliconAuto, a 50/50 joint venture dedicated to designing and selling a family of state-of-the-art semiconductors to supply the automotive industry, including Stellantis, starting in 2026. The joint venture combines Foxconn’s development capabilities and domain expertise in the ICT industry with Stellantis’ deep understanding of diverse mobility needs around the world. SiliconAuto will provide customers an auto industry-centric source of semiconductors for the growing number of computer-controlled features and modules, particularly those needed for electric vehicles. Products from SiliconAuto will support the future semiconductor needs of Stellantis, Foxconn and other customers. This includes STLA Brain, Stellantis’ new electrical/electronic and software architecture with full over-the-air updating capabilities. “Stellantis will benefit from a robust supply of essential components, which is critical to fueling the rapid, software-defined transformation of our products,” said Stellantis Chief Technology Officer Ned Curic. “Our goal is to build vehicles that seamlessly connect with our customers’ daily lives and deliver class-leading capabilities years after they leave the assembly line. With this joint venture, we can create purpose-built innovations with an efficient partnership.” “We look forward to a future of extraordinary EV mobility underpinned by the vertical integration capabilities and resources SiliconAuto secures for our partners,” said Foxconn Chief Product Officer Jerry Hsiao. “The collaborative energy will propel our customers to become more competitive.” SiliconAuto will be headquartered in the Netherlands. The management team includes executives from both founding partners. Stellantis will provide input to SiliconAuto to enable and deliver capabilities needed by future battery electric vehicles and multi-energy vehicle platforms. The joint venture is the product of a December 2021 agreement between Stellantis and Foxconn to develop a family of semiconductors for automotive applications. In addition to SiliconAuto, Stellantis and Foxconn have the Mobile Drive joint venture focused on developing smart cockpits enabled by consumer electronics, human-machine interfaces and services.   About Hon Hai Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking in the top 20 among the Fortune Global 500. In 2022, revenue totaled TWD6.62 trillion (approx. USD220 billion or EUR200 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and others. The Group operates 173 campuses across 24 countries and is one of the world’s largest employers with over a million employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – new-generation communications technology, AI, and semiconductors – which are key to driving its long-term growth strategy. It is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practices model for global enterprises. To learn more, visit www.honhai.com About Stellantis Stellantis N.V. (NYSE: STLA / Euronext Milan: STLAM / Euronext Paris: STLAP) is one of the world’s leading automakers and a mobility provider. Its storied and iconic brands embody the passion of their visionary founders and today’s customers in their innovative products and services, including Abarth, Alfa Romeo, Chrysler, Citroën, Dodge, DS Automobiles, Fiat, Jeep®, Lancia, Maserati, Opel, Peugeot, Ram, Vauxhall, Free2move and Leasys. Powered by our diversity, we lead the way the world moves – aspiring to become the greatest sustainable mobility tech company, not the biggest, while creating added value for all stakeholders as well as the communities in which it operates. For more information, visit www.stellantis.com.