City University of Hong Kong (CityUHK) and the Hon Hai Research Institute of the Hon Hai Technology Group (Foxconn) jointly established the Foxconn-CityUHK Joint Research Centre. The aim of the centre is to combine the scientific research efforts of industry and the academic sector to advance innovative research projects in artificial intelligence, semiconductor, next-generation communications, information security and quantum computing.  The opening ceremony of the joint research centre was held on 12 June. Officiating guests included Professor Freddy Boey, President of CityUHK; Dr Lee Wei-bin, Chief Executive Officer and Director of the Information Security Research Centre of the Hong Hai Research Institute; Professor Ma Wei Ying, Huiyan Chair Professor and Chief Scientist of the Institute of AI Industry Research at Tsinghua University; Professor Kuo Tei-wei, Chief Technology Officer, Delta Electronics; Professor Lee Chun-sing, Provost and Deputy President of CityUHK; and Professor Wang Jianping, Associate Provost (Academic Affairs) of CityUHK and Director of the joint research centre, among others. Speaking at the opening ceremony, President Boey said, “We are honoured that CityUHK has been chosen as the first university partner of the Hon Hai Research Institute globally to work together to establish a joint research centre. This collaboration signifies the shared vision of CityUHK and the Hon Hai Research Institute to address the challenges of our times through innovative research. The joint research centre will serve as a collaborative platform for the elites from industry and the academic sector to nurture innovative ideas and advance the development of innovation and technology.” Dr Lee said, “The Hon Hai Research Institute will continue to work closely with CityUHK. We hope that the joint research centre will contribute to breakthroughs in the future development of innovation and technology.” CityUHK representatives and the Hon Hai Research Institute delegation visited the joint research centre after the opening ceremony to conduct further discussions on the future direction of the centre.  Officiating at the opening ceremony of the Foxconn-CityUHK Joint Research Centre are President Boey (third right), Dr Lee (third left), Professor Ma (second left), Professor Kuo (first left), Professor Lee (second right) and Professor Wang (first right). Attending the opening ceremony of the Foxconn-CityUHK Joint Research Centre are President Boey (seventh right), Dr Lee (seventh left), CityUHK representatives and the Hon Hai Research Institute delegation.

[Taipei, June 17, 2024] – Foxconn Interconnect Technology Ltd ("FIT", listed on the Hong Kong Stock Exchange under 6088), a subsidiary of Hon Hai (TW.2317), is expanding its presence in the electric vehicle (EV) sector. Following the acquisition of Germany's SWH Group in 2023 and the launch of the Voltaira brand for its mobility solutions portfolio, FIT Hon Teng has formed a joint venture with XYPower Technology Co., Ltd., establishing FXNWING New Energy Technology Co., Ltd. ("FXNWING") to enter the EV charger market. XY Power, based in Xi'an, specializes in EV charging and energy storage systems. With over 25 years of experience, their expertise in power module design will enhance FXNWING's production capabilities. Combined with FIT Hon Teng's manufacturing strengths, this partnership aims to deliver top-notch charging  and energy restorage solutions globally. With growth potential in the EV market, FIT will continue to partner with core technical experts to leverage business opportunities by shortening development times and enhancing the solution packages. Along with the the One-FIT strategy, the strong cooperation between FXNWING and Voltaira has resulted in a new series called Voltaira AC and DC chargers. The debut product Voltaira Anoles AC charger offer 7kW and 22kW charging power and has won the 2024 IF Product Design Award by featuring its interchangeable covers and easy cable and socket replacement to comply with various international standards. Its modular design and improved heat dissipation make it adaptable to different environments. At Europe’s largest smart energy exhibition, Smarter E Europe, on June 19-21, 2024, visitors were able to explore the Voltaira Royal Series. Targeting the Middle East and North Africa (MENA) market, the Royal Series includes DC fast charging stations and AC chargers for commercial and residential use. Designed for harsh climates, these products feature robust protection and intelligent power distribution to achieve high efficiency and reduce operational costs. FXNWING's innovation is further evidenced by the FitPile,the mini DC which has won a Red Dot Design Award. This recognition highlights FIT Hon Teng's commitment to innovation and technical excellence. Visit us at Messe München, Germany (MESSE) C6.635. About FIT (Foxconn Interconnect Technology) Hon Teng (HK.6088) Foxconn Interconnect Technology (FIT), listed on the Hong Kong Stock Exchange, focuses on precision design and manufacturing of connector products as its core. FIT continues to explore 5G AIoT, EV mobility, and audio applications areas, stepping into consumer brand operations. For more information about FIT, please see: www.fit-foxconn.com. Email: fit-ir@fit-foxconn.com         sales-usa@fit-foxconn.com    

(Taipei, June 02, 2024) As a global pioneer in AI solutions and cloud infrastructure, Ingrasys, a subsidiary of Foxconn Technology Group, today announced that it will showcase its latest AI and data center products, solutions, as well as critical green technologies for enhanced cooling and energy efficiency under the theme of "Next-Gen AI Computing" at Computex Taipei 2024. "AI is accelerating digital transformation across industries," stated Benjamin Ting, President of Ingrasys. "Our AI products and solutions, integrating cutting-edge hardware and software R&D with advanced performance, deliver high-performance, energy-efficient, and scalable offerings to drive green digital transformation and unleash AI's boundless potential." Ingrasys Highlights at Computex 2024: As a pioneering partner in integrating NVIDIA's Blackwell architecture GPUs, Ingrasys unveils the future of next-generation AI data centers by showcasing the latest NVIDIA GB200 NVL72 rack-scale solution. This system supports multi-node and liquid cooling, connecting 72 Blackwell GPUs with 36 Grace CPUs into a single giant GPU, capable of delivering trillion-parameter LLM training and real-time inference.  With the rising demand for enormous AI computing power, the importance of liquid cooling technology has become increasingly evident. Ingrasys showcases advanced liquid cooling solutions, including the liquid-to-air side car solution and the liquid-to-liquid CDU solution, addressing the diverse needs of various data center environments and offering the most comprehensive AI data center solutions. Ingrasys also introduces a series of modular innovations, including self-developed modular servers that support the latest AMD EPYC™ processors and Intel® Xeon® processors, as well as a broad portfolio of 1U/2U/4U NVIDIA MGX™ Systems to meet diverse accelerated computing needs. Additionally, Ingrasys presents the latest liquid-cooled and air-cooled AI accelerators that support different platforms, including NVIDIA HGX™ H200/B100/B200, AMD Instinct™ MI300X platform and Intel® Gaudi® 3 accelerators, offering a wide array of options for optimized performance and flexibility in AI workloads. As Foxconn Technology Group's AI-focused subsidiary, Ingrasys has injected robust momentum into the group's AI and cloud computing businesses. According to Foxconn's Q1 2024 earnings call, AI server revenue nearly doubled year-over-year, with expectations for continued quarter-over-quarter growth. General server demand is also witnessing a sustained rebound, positioning the overall server segment for robust growth. With years of dedication in the AI field, Ingrasys continuously introduces innovative, high-quality products and solutions with rapid development cycles. Leveraging its diversified AI portfolio and profound expertise, Ingrasys maintains close collaboration with partners, jointly contributing to AI technological advancements and driving global industrial digital transformation. We cordially invite you to visit the Ingrasys exhibit to experience our latest AI innovations and engage with our team. Ingrasys at Computex 2024: Dates: June 4 - June 7 Location: Taipei Nangang Exhibition Center, 4F, Booth #L0309a About Ingrasys Ingrasys is a global leading cloud infrastructure pioneer that leverages innovative technologies – including hyperconverged infrastructure, HPC with CDI architecture, AI/ML, and advanced cooling solutions – to meet sophisticated data center needs worldwide. Its extensive product portfolio spans servers, storage, HPC accelerators, workstations, and integrated services. By continuously developing cutting-edge technologies and closely tracking industry trends, Ingrasys fosters long-term partner relationships, delivers exceptional client support, and drives innovation within the hyper-scale cloud ecosystem.

TAIPEI, TAIWAN – March 30, 2024 – The MIH Consortium, since its founding, has swiftly gathered over 2,700 members, establishing itself as a key global platform within the mobility industry. Today, MIH is pleased to announce that Mr. Jun Seki, Foxconn’s Chief Strategy Officer for EVs, will take on the CEO role effective April 1st, 2024. This pivotal change aims to advance industry standardization, unlock new business opportunities, and foster innovation within smart mobility. The Consortium is dedicated to assisting members in entering the electric vehicle and mobility industries, focusing on uniting industry efforts, addressing challenges, and adopting the following strategies: Industry Standards Development: Leveraging Taiwan's Information and Communication Technology (ICT) strengths to join forces with members to define standards for the electric vehicle industry. A Collaborative Platform: Fostering partnerships within our community and with international industry bodies and governments. Offering Targeted Support: Providing support tailored to our members' needs to effectively tackle the challenges of the EV and mobility markets. Expanding Opportunities: Assisting members in exploring global markets and seizing emerging business opportunities. Moving forward, we're dedicated to the principles of sharing, cooperation, and collective prosperity, and to driving innovation and opportunities with members.

[March 25, 2024 - Taipei] AI-generated applications are escalating the demand for higher computing power. In response, Foxconn Interconnect Technology Ltd ("FIT", listed on the Hong Kong Stock Exchange under 6088), a subsidiary of Hon Hai (TW.2317), is joining forces with MediaTek to co-develop a groundbreaking 51.2T solution, inclusive of Co-Packaged Optics (CPO). CPO is designed to revolutionize the integration of optical transceivers by incorporating them directly onto the same package as the ASIC, moving away from traditional separate modules. Building upon the foundation laid by the Red Dot Design Award-winning FITCONN 800G high-speed connector, FIT seeks to further advance its CPO capabilities by utilizing MediaTek's cutting-edge ASIC platform, which includes high-speed SerDes and silicon photonics technologies. Leveraging FIT's adeptness in CPO socket creation and integration capabilities, this collaboration will deliver superior high-performance computing systems tailored for switches within front-end and back-end networks. Within data centers, CPO is instrumental in increasing bandwidth and reducing electrical pathways, thereby improving latency and accelerating data transmission speeds. The architecture's ability to demonstrate significant total system power savings underscores its value and potential. From a connectivity standpoint, CPO enriches FIT's existing optical communication offerings, spanning 800-1600G, and collaborating with MediaTek will enable the evolution of next-generation network communication technologies. "We are deeply honored to partner with MediaTek on this venture. This trailblazing technology is expected to introduce revolutionary products to the market, ensuring stable and reliable high-speed connectivity solutions," said Mr. Joseph Wang, CTO of FIT Hon Teng. "Anticipating the product's launch, we are committed to collectively furnishing our customers with a broader spectrum of efficient connectivity solutions, thereby propelling the high-performance computing era forward." "MediaTek’s vision is to deliver versatile ASIC platforms to clients, providing them with state-of-the-art technologies designed for the rapidly-expanding data center and server markets,” said Vince Hu, Corporate Vice President at MediaTek. “By working together with FIT on the CPO initiative, we will create new market opportunities by enabling and powering next-generation high-speed transmission solutions.” MediaTek is slated to unveil its product lineup, showcasing FIT's CPO socket, in March 2024 at OFC, the premier global event dedicated to optical communication and networking.   About FIT (Foxconn Interconnect Technology) Hon Teng (HK.6088) Foxconn Interconnect Technology (FIT), listed on the Hong Kong Stock Exchange, focuses on precision design and manufacturing of connector products as its core. FIT continues to explore 5G AIoT, EV mobility, and audio applications areas, stepping into consumer brand operations. For more information about FIT, please see: www.fit-foxconn.com.

Revolutionizing Data Center Connectivity: FIT Unveils 224G Data Rates at DesignCon 2024 - A Leap Forward in AI and Machine Learning Era [Santa Clara, 2023/01/29] – Foxconn Interconnect Technology (FIT), a frontrunner in the data center connectivity industry, proudly announces the launch of its 224G data rates for high-speed I/O and near-chip connectivity at this year's DesignCon. This groundbreaking development in 224G signifies a strategic step forward, preparing FIT and its key customers for the burgeoning data rates propelled by advancements in AI and machine learning. The 224G standard demands exceptional levels of signal integrity, mechanical robustness, and manufacturing precision. Terry Little, Development Engineering Manager and System Architect at FIT, states, "connectors with 224G interfaces require innovative design approaches, extending beyond conventional development norms. This necessitates creative thinking in electrical contact design, tighter mechanical and manufacturing tolerances, and more stringent assembly processes." FIT is dedicated to offering these specialized capabilities to the industry, providing crucial thermal and mechanical design guidance for QSFP-DD1600 and OSFP MSAs. Alex An, Senior Director of Business Development at FIT, emphasizes, “Our amalgamation of industry experience near the chip, extensive manufacturing knowledge, and expertise in high-volume automation creates the perfect synergy to significantly contribute to high-speed MSAs or consortiums. These components are essential in driving AI, hyperscale, and enterprise solutions. FIT stands out in its ability to pioneer and scale copper connectivity solutions originating from the chip, including co-packaged solutions, near-chip connectors, and 224G internal cabling to IO.” FIT is swiftly progressing in the development of near- or on-chip connectivity. With the expansion of the back-end network, there's a pressing need to move beyond traditional board layers. Alex adds, “The challenge extends beyond high speed – managing power is also a critical hurdle. As a provider of connector solutions, our focus is on integrating high power density into mission-critical components without sacrificing other architectural aspects. Collaborating with our clients to solve these pivotal challenges remains a primary focus of our efforts.” Aligned with its '3+3 strategy', FIT is concentrating its resources on key markets such as Electric Vehicles (EVs), Audio, and 5G AIoT to foster margin growth. The company is enthusiastic about showcasing its latest innovations at DesignCon 2024, underscoring its commitment to its customers and their growth in these vital sectors. Attendees at Design Com are invited to visit FIT's booth [619] for an exclusive firsthand look at the Datacent Connector.

10G multi-gigabit Automotive Ethernet link to be demonstrated over a 15-meter cable using Broadcom PHY technology. Santa Clara, Calif., January 29, 2024 -- Foxconn Interconnect Technology (6088.HK) (“FIT”), a leading connective solution provider creating powerful connections for a better world, today announced the demonstration of its 10G multi-gigabit Automotive Ethernet cable and connector solutions at the DesignCon 2024 exhibition in Santa Clara, California from January 30th to February 1st. FIT’s FoxNet GII Multi-Gig Automotive Ethernet Connector and Cable will appear together with Broadcom’s 10G PHY Automotive Ethernet Evaluation Board. This demo will feature Broadcom’s BCM89890 multi-gigabit Automotive Ethernet PHY chip, connected with FIT’s 15-meter Foxnet GII Multi-Gig Cable, which includes 4 in-line connectors. This cable link supports the IEEE 802.3ch specification which is rated for 2.5, 5 and 10 Gbps for Automotive Ethernet applications and compliant with OPEN Alliance TC9 standard for Single Pair Ethernet (SPE). The IEEE 802.3ch specification also identifies a maximum length 15-meter cable assembly, with up to 4 in-line connectors. FIT’s FoxNet GII connector and cable family includes (1) Single Port Configuration (as shown in the demo), (2) In-Line Connector Configuration (as shown in the demo), (3) 2x2 (4 port) Connector Configuration, and (4) 1x2 (2port) Connector Configuration. FIT will be conducting a live demonstration of its 10G multi-gigabit Automotive Ethernet link over a 15-meter cable assembly in the FIT Booth #619. This live demo will continuously monitor the bit error rate (BER) across the 15-meter cable length (with 4 in-lines), sending and receiving packets of data continuously. Applications: ‧ Domain Controller, Gateway (Zonal Architecture) ‧ Advanced Driver Assistance Systems ‧ 4D Radar ‧ Lidar ‧ High-resolution 4K Displays ‧ Rear Seat Entertainment ‧ 4K Camera Systems ‧ Intelligent Headlight Protocols Supported: ‧ 100BASE-T1   1000BASE-T1   Multi-Gigabit (2.5, 5 and 10 Gbps ,IEEE 802.3ch) ‧ Beyond 10 Gbps (IEEE 802.3cy) ‧ PCIe (to be optimized), LVDS SerDes (FPD Link, GMSL, Motion Link, MIPI PHYs, HSMT) About FIT Hon Teng Foxconn Interconnect Technology (FIT) is a leading global solutions developer and manufacturer, cultivating connectivity for a better world. With unsurpassed capabilities in development, research, manufacturing engineering and design, production, supply chain, and go-to-market planning for world class brands and private label products spanning B2C and B2B categories, FIT is at the forefront of worldwide technological trends delivering compelling user experiences at scale. With offices and manufacturing sites located in Asia, the Americas and Europe, FIT is a global leader in the manufacturing of high precision interconnect components. For more information, visit FIT’s website: https://www.fit-foxconn.com.

Denver, Colorado (Nov, 2023) – Ingrasys, a global leading cloud IT and infrastructure provider, announced today its participation at Supercomputing 2023 on November 14- 16 at the Colorado Convention Center. Focusing on paving the way for next-generation AI-enabled applications and services, Ingrasys will unveil its all-new, liquid-cooled AI servers, as well as its advanced liquid cooling racks, to share its latest efforts in building and pioneering sustainable solutions for the AI era. As data centers face rising power consumption and cooling challenges, fueled by the demands of AI and high-performance computing, Ingrasys has been developing eco- conscious liquid cooling solutions to improve data center efficiency and sustainability. In booth 2125, Ingrasys will display its newest AI liquid server, the GB6181, which hosts eight NVIDIA H100 Tensor Core GPUs to deliver a staggering 32 petaFLOPS of performance for giant-scale AI and LLM inference and training and can be easily integrated into OCP ORv3 racks that customers’ data centers can deploy. Two new additions to the modular building block series, the SV1123A and SV1143A, are making their debut. The two high-density 1-node and 2-node modular servers feature liquid cooling technology and support NVIDIA’s latest PCle GPUs, such as NVIDIA L40S and NVIDIA L4 Tensor Core GPUs, for unparalleled AI and graphics performance. The front-flexible modules allow different configurations of E1.S, U.2, and two PCIe form factors, meeting diverse needs and applications. Visitors will also have a chance to explore the LA0763, an OCP ORv3 side-car liquid- cooling solution that has a high cooling capacity of up to 76kW and features a modular RPU (reservoir and pumping unit) and radiator. The side-car solution can be seamlessly deployed alongside IT racks without the need to modify the existing data center infrastructure, which not only saves considerable deployment time but also makes it an efficient choice for data center operators aiming to enhance cooling capabilities while maintaining operational continuity. Other innovative displays include the high-performance NVMe-oF storage system featuring the NVIDIA Spectrum-2 Ethernet switch to deliver high throughput with low- latency, HPC servers featuring the NVIDIA GH200 Grace Hopper Superchip and NVIDIA Grace CPU Superchip for the surging demand of generative AI, as well as achievements in immersion cooling technology that significantly reduce data center power consumption. As always, Ingrasys continues to empower customers with the right solutions they need in today’s dynamic world. About Ingrasys Ingrasys Inc., a global leading cloud infrastructure provider, leverages innovative technologies – Hyper-Converged Infrastructure (HCI), Composable Disaggregated Infrastructure (CDI), HPC, AI/Machine Learning, and Advanced Cooling – to provide worldwide customers with tailored solutions that drive their business forward. For more information about Ingrasys, visit Ingrasys website.

28 August 2023, Taipei, Taiwan and Chihuahua City, Mexico – Hon Hai Technology Group (“Foxconn”) (TWSE:2317), a global leader in high-tech manufacturing, and the Chihuahua State Government are excited to announce a strategic partnership aimed at advancing talent training, fostering innovation technology, and promoting sustainable energy development in Mexico’s largest state. This partnership reflects a shared vision between Foxconn and the Chihuahua State Government to elevate the latter’s industrial capabilities, empower its workforce, and contribute to sustainable economic development. By combining expertise and resources, the effort is anticipated to drive positive change, shape the future of manufacturing, and contribute to the prosperity of Chihuahua and its residents. The focus will be threefold: Seizing Opportunities from Nearshoring The thriving landscape of nearshoring presents immense opportunities along with unique challenges for the State of Chihuahua. Foxconn has invested over half a billion US dollars in the state and is one of the leading maquiladoras in Mexico. The partnership will focus on optimizing supply chains, enhancing infrastructure, and fostering an environment conducive to growth and innovation. 2.    Empowering Human Talent and Driving Innovation Foxconn is committed to nurturing a talent pool equipped with cutting-edge skills to meet the demands of the evolving ICT & Automotive industry. In partnership with the state, we aim to develop training programs and initiatives that will empower the workforce and position Chihuahua as a hub for innovation-driven manufacturing. 3.    Collaborative Efforts in Electricity Development Together with the Chihuahua State Government, Foxconn aspires to enhance energy efficiency, explore renewable energy sources, and support sustainable power solutions. This collaboration underscores our shared commitment to environmentally responsible practices and driving positive change for the business community in San Jerónimo and Juárez.   About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking in the top 30 among the Fortune Global 500. In 2022, revenue totaled TWD6.62 trillion (approx. USD220 billion or EUR200 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and others. The Group operates 173 campuses across 24 countries and is one of the world’s largest employers with over a million employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – new-generation communications technology, AI, and semiconductors – which are key to driving its long-term growth strategy. It is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practices model for global enterprises. To learn more, visit www.honhai.com   (News From: 'Grupo de Tecnología Hon Hai (Foxconn) y Gobierno del Estado de Chihuahua forjan Asociación para la Manufactura de Alta Gama e Innovación Sostenible.')

JAKARTA, 21 August 2023 – PT Ilectra Motor Group (IMG or ALVA) with its brand ALVA has finalized its Series B fund raise, totalling up to USD50 million. The round which included all previous investors, is led by Horizons Ventures. New investors include HH-CTBC Partnership, L.P. (Foxconn Co-GP Fund), which together with Horizon Ventures and Indika Energy, form the largest investors of IMG to date. New investors other than Foxconn Co-GP fund include Brama One Ventures. Proceeds from the Series B funding will be used to continue accelerating ALVA’s product developments and scaling up network expansions in order to serve more consumers all over Indonesia.  ALVA envisions itself to become a global electric mobility champion and reshape sustainability. IMG was initiated in 2021 to build a lifestyle mobility solution focusing not only on electric two-wheeler product development but also its supporting ecosystem, which is very much still nascent.  Utilizing its R&D capability built since the beginning, IMG launched its second model of electric motorcycle products, “ALVA Cervo”, in May 2023. This second model, together with “ALVA One”, a model that was launched 12 months ago, will bolster IMG’s penetration into the 2-wheeler EV market. With these models, ALVA has achieved a leading position in the premium E2W market in Indonesia. Supporting its end-to-end operations, IMG’s manufacturing facility at Cikarang, West Java, has been operating since the fourth quarter of 2022 with a total capacity of 100,000 units per year. Furthermore, ALVA Experience Center in SCBD, Jakarta, as well as ALVA Studio at Mall Bali Galeria, Bali, are in full operations to support its consumer brand experience, sales and after sales services. Indonesia is a fertile market with a large potential for electric two-wheel (E2W) vehicles. The country currently holds the highest two-wheelers ownership penetration in the world (around 42%, based on the number of vehicles owned per 100 population) and is the third-largest market for two-wheelers with approximately 6 million motorcycles sold annually. The E2W market is projected to grow rapidly as prices are comparable to existing non-E2W products with much lower operational costs, supported by the government’s active role in pushing for electrification, providing infrastructure and promoting conversion into E2W products. Seeing the big potential, IMG sets a big target to become a leading two-wheel electric vehicle player in Indonesia. “ALVA strives to provide high-quality products tailored for Indonesian consumers in all aspects of urban transport including performance, battery range, and safety. Since day one, we have mapped out customers’ various need and translated them in our product developments and services. We also adopt the latest EV technologies, integrating them into our electric motorcycle products and our digital “My Alva” app which became an integral part of our value propositions in delivering unique user experience. For these reasons, our two models have been well received by the market. We continue to set the standard for E2W through our strong R&D and domestic market insights, while at the same time improve and re-define customer experiences (CX) as we expand our coverage to the whole of Java and Bali in 2023” says Purbaja Pantja, President Director and CEO of IMG.   “Indonesia has enormous potential in the development of electric vehicles. We look forward to continuously innovating and developing ALVA, as well as expanding its market across Indonesia. Indika Energy is excited to team up with exceptional partners including Horizons Ventures, HH-CTBC Partnership, L.P. (Foxconn Co-GP Fund), Alpha JWC Ventures, and Brama One Ventures to support our objective of providing a comprehensive EV ecosystem in Indonesia,” says Azis Armand, Vice President Director and Group CEO at Indika Energy. “We are thrilled to announce our collaboration with ALVA, an EV two-wheeler made in Indonesia for Indonesians. It’s our privilege to be part of ALVA’s mission, taking a significant stride towards a more sustainable future for Indonesia through the adoption of an intelligent and cleaner EV ecosystem. ALVA’s two-wheeler product exemplifies a seamless integration of technology and scalability, which will be the crux to revolutionize daily urban commuting,” says Frances Kang from Horizons Ventures. “Indonesia has committed to achieving ambitious net-zero emissions objectives. Indika Group plays an important role in supporting Indonesia's green transformation and bolstering its standing on the international stage. With the delivery of superior E2W products which could only happen with strong market insights and the dedication to improve customer satisfaction through seamless end-to-end CX, we firmly believe that ALVA will fully capitalize on the extensive market potential in Indonesia. Together, we can foster a more sustainable environment and transform the 2W industry at full speed and in a significant way.” says James Tu, Chief Investment Officer at Foxconn.     ABOUT INDIKA ENERGY PT Indika Energy Tbk. (Indika Energy) is Indonesia’s leading diversified investment company with key focus on developing new sustainable businesses through its strategic investments in the areas of Energy - coal production (PT Kideco Jaya Agung, PT Multitambangjaya Utama), coal trading (Indika Capital Investment Pte. Ltd.), EPC oil & gas (PT Tripatra Multi Energi, PT Tripatra Engineers & Constructors, PT Tripatra Engineering); Logistics and Infrastructure - ports & logistics (PT Indika Logistic & Support Services, PT Kuala Pelabuhan Indonesia), fuel storage (PT Kariangau Gapura Terminal Energi), coal-fired power plant (PT Cirebon Electric Power and PT Prasarana Energi Cirebon); Minerals - gold production (PT Masmindo Dwi Area), nickel trading (PT Rockgeo Energi Nusantara); Green Businesses - nature based solution (PT Indika Multi Properti), renewable energy (PT Empat Mitra Indika Tenaga Surya); Electric Vehicle (PT Ilectra Motor Group, PT Mitra Motor Group); Digital Ventures - IT enterprise (PT Xapiens Teknologi Indonesia); Others – health industry (PT Indika Medika Nusantara, PT Bioneer Indika Group). www.indikaenergy.co.id