Riyadh, Saudi Arabia –Ministry of Energy has announced the formation of a groundbreaking joint venture between Saleh Suleiman Alrajhi & Sons and Foxconn Interconnect Technology (FIT), a highly esteemed global manufacturer to support the Kingdom's Vision 2030. The partnership aims to produce Saudi-made electric vehicle (EV) charging stations, strengthening Saudi Arabia’s leadership in renewable energy and technological innovation. This partnership is endorsed by Prince Abdulaziz bin Salman Al-Saud, Minister of Energy; Mr. Bandar Alkhorayef, Minister of Industry and Mineral Resources; and Mr. Hamad Al Sheikh, a government minister, reflecting strong support from the Saudi authorities. On behalf of Saleh Suleiman Alrajhi & Sons, Next Charger, the company’s subsidiary, has accumulated highly respected experience in the local charging pile industry. The collaboration with major European brands and local distributors has contributed extensive practices which will be leveraged in the joint venture, providing valuable insights and proven strategies for success. The signing ceremony is inaugurated by HH Prince Fahad bin Nawaf Al Saud who emphasized his shared vision under the leadership of HRH the crown prince Mohammad Bin Salman. “We are committed to creating a sustainable and diverse future for the Kingdom,” Prince Fahad declared. By sharing his perspective as a forward-thinking entrepreneur and prestigious market leader, Prince Fahad envisions the joint venture as pivotal in driving the growth of electric mobility across Saudi Arabia. FIT, a subsidiary of Foxconn Technology Group, has comprehensive charging solutions evidencing its excellent design capability for power modules and top-notch manufacturing capability. “By reducing the Kingdom’s reliance on imports and fostering domestic expertise, we can boost job creation and enhance the country’s technological self-sufficiency. Partnering with FIT is a strategic step toward local manufacturing,” Said Saleh Suleiman Abdulaziz AlRajhi, Chairman of Saleh Suleiman Alrajhi & Sons. FIT has already achieved significant milestones, including the certification of its AC charger by the Saudi Standards, Metrology and Quality Organization (SASO). Their award-winning design team, recipient of the 2024 IF Design Award and Red Dot Award, will bring unparalleled customization options to the joint venture, tailoring charger designs to meet market preferences. Louie Yeh, Head of FIT’s charging pile business, commented: “Our joint venture will prioritize the development of high-quality charging stations designed for optimal performance in Saudi Arabia’s unique environmental conditions. Given the intense sunlight, our products underwent UV testing to ensure durability.” The signing ceremony also underscored the partnership’s broader impact, extending beyond technological innovation to focus on talent development for the Kingdom’s future. Mr. Andreas Cangellaris, Founding President of NEOM University, was in attendance, reuniting with Sidney Lu, Chairman & CEO of FIT. Both men share a strong connection to the University of Illinois Urbana-Champaign (UIUC), where Lu’s contributions led to the renaming of the Mechanical Engineering Building in his honor, and where Mr. Cangellaris previously served as Provost before joining NEOM. This joint venture not only represents a critical step forward for the Kingdom’s renewable energy sector but also underscores a commitment to shaping the next generation of skilled professionals. "Through this partnership, we aim to drive innovation in EV charging solutions while cultivating local talent, aligning with Vision 2030’s goals of creating a sustainable, diversified economy," the companies jointly stated. About Saleh Suleiman Alrajhi & Sons Saleh Suleiman Alrajhi & Sons, established in 2011, is a prominent and well-established family business in Saudi Arabia. Their business dates back to 1957 when the world’s first Islamic bank was established. Over the years, the family has played a significant role in the country’s economic reforms and initiatives. With a diverse portfolio spanning healthcare, construction, steel and manufacturing, and technology, Alrajhi is driving growth through strategic partnerships with global industry leaders, embracing innovative practices, and incorporating a range of perspectives to boost its competitiveness on the international stage. The company also invests in promising future technologies that align with Vision 2030.   About Foxconn Interconnect Technology (FIT Hon Teng) Foxconn Interconnect Technology (HKEX: 6088) was listed on the Hong Kong Stock Exchange in 2017 and is the largest consumer electronics connector manufacturer in Greater China. While connectors remain its core business, the company has strategically expanded in recent years into 5G AIoT, electric vehicles, and acoustic electronic components, while also entering the consumer brand sector. For more information, please visit the company’s website at www.fit-foxconn.com  

Hong Kong –  October 17, 2024 – FIT Hon Teng (6088-HK), a subsidiary of Hon Hai Precision Industry (2317-TW), will unveil its latest advancements in AI data center connectivity and immersion-cooling technologies at the upcoming 2024 OCP Global Summit. Hosted by the Open Compute Project (OCP), this prestigious event brings together global leaders in hardware infrastructure design, addressing the evolving demands of modern data centers. At the summit, FIT will introduce solutions that tackle critical challenges in AI-driven data centers, including signal degradation, heat dissipation, and large-scale manufacturing scalability. FIT’s AI rack connectivity innovations are designed to enhance signal integrity and optimize data transmission, all while incorporating advanced cooling technologies for high-density AI workloads. Key product highlights include: - 224G+ sockets for XPU/GPU connectivity - Co-packaged copper and optical architectures - Power cables for ORV3 - Active Optical Cables (AOC) - OSFP1600 and QSFP-DD port configurations These solutions underscore FIT’s commitment to driving innovation in the AI data center space, building on Foxconn’s extensive industrial internet expertise to offer cutting-edge AI connectivity solutions to global data center customers. In addition to its AI connectivity offerings, FIT will present its immersion-cooled IT platform solutions at the summit. Terry Little, Development Engineering Manager at FIT, will lead a session titled “Optimizing Signal Integrity in Immersion-Cooled IT Platforms.” The session will delve into the effects of dielectric fluids on high-speed signal lines, the challenges of high-speed testing in such environments, and innovative connector fixture strategies. These solutions are critical for ensuring reliable performance in harsh, high-density computing environments, such as AI data centers. By addressing key issues such as performance, efficiency, and scalability, FIT continues to play a pivotal role in supporting the growth of AI infrastructure across industries, further solidifying its leadership in AI data center solutions. About Foxconn Interconnect Technology (FIT Hon Teng) Foxconn Interconnect Technology (HKEX: 6088) was listed on the Hong Kong Stock Exchange in 2017 and is the largest consumer electronics connector manufacturer in Greater China. While connectors remain its core business, the company has strategically expanded in recent years into 5G AIoT, electric vehicles, and acoustic electronic components, while also entering the consumer brand sector. For more information, please visit the company’s website at www.fit-foxconn.com Media Contact: Email: fit-ir@fit-foxconn.com   Product and Service Inquiries: Europe and America Contact: sales-usa@fit-foxconn.com       

⚫️A total of 40m axle sets globally produced since 1994 ⚫️A total of 7.9m axle sets produced in China since 2003 ⚫️Shenyang Tiexi Plant will be put into use in 2025 ⚫️Continuous growth prospects through strong order intake and outsourcing trend ⚫️Global sales increase expected from actual US Dollar 4.4 bn (Euro 4bn) to 8.8 bn (Euro 8bn) in 2029 29.08.2024 Osnabrueck # The global automotive supplier ZF Foxconn Chassis Modules (ZFFCN) expects to double its annual sales from actual US Dollar 4.4bn to US Dollar 8.8bn until 2029. Contrary to the situational decline in the global automotive market, ZFFCN is benefiting from a strong order intake of top tier OEM also for its China-based plants and ongoing outsourcing trends. Now, Tiexi plant will put into use in 2025 for additional volume production. Meanwhile, ZFFCN celebrates 30 years of chassis modules excellence in all its 25 international locations. Today ZFFCN looks back on 30 years of axle modules assembly. The supplier legacy of the 50-50 joint venture between ZF Friedrichshafen AG and Foxconn (Hon Hai Technology Group) traces back to August 1994, when the first axle sets left the plant in Duncan (USA) towards customer BMW. Since then, the customer proximity, logistics, and assembly expertise are valued through long-lasting partnerships with the world’s leading OEM such as BMW, Mercedes-Benz, Stellantis, and Jaguar Land Rover. Eike Dorff, CEO of ZF Foxconn Chassis Modules explains:“Today we have two good reasons to celebrate. Firstly, for thirty years our valued teams around the world have proven that our chassis modules expertise is market-leading. Experience, adaptability, unconditional customer focus, and passion remain our guarantors for the client’s success. We are very grateful for our customers, partners, and shareholders for their trust in us. And secondly, Iam very content, that our recent strong order intake leads to long-term business growth for our Chinese business and attracts new customers.” Dr. Xu Jun, ZF Foxconn Chassis Modules China Vice President adds: “Celebrating 30 years of chassis modules excellence overall and 21 years of successful axle systems business in China, is a remarkable testament to the loyalty of our customers and the hard work of our team. I am really happy to celebrate this achievement today and feel grateful for all partners accompanying our success story in China. With great pride and excitement our team is looking forward to several new contracts and the erection of a brand-new plant in China.” Growth perspective in China: New plant in Tiexi district and new car models Additionally to the 2 existing axle module production for 11 different car models from 2 top tier OEM in Shenyang and Beijing plants, ZFFCN will start the production of front and rear axle sets for a new platform in 2026 at Beijing plant. Furthermore, the existing ZFFCN Shenyang plant is expected to start production of an additional, completely new vehicle platform by the year 2028 in a larger volume. Meanwhile the new plant in Tiexi District will start operations in 2025 for additional volume production. Business Excellence for renown and disruptive customers With an unparalleled quality management, agile JIT/JIS processes, and a technology-open approach, ZFFCN plans to evolve its region’s services to attract new customers especially from China’s vast New Electric Vehicle (NEV) portfolio. ZFFCN’s Taiwanese shareholder Foxconn provides additional market proximity and technology know-how throughout the whole AP region. Technology-open approach ZFFCN strives to be at the fore front of the automotive industry, leveraging its expertise in logistics, operations, industrialization, and engineering to deliver added value to a variety of different customers. Many years of portfolio experience and adaptability enable ZFFCN to support its customers globally in a technology-open manner offering services for Combustion Engine (ICE), Hybrid or Fully Electric/ Battery Electric (BEV) vehicles. Visual: ZFFCN_PI_Chassis Modules Production_Logistics   About ZF Foxconn ZF Foxconn Chassis Modules is a 50-50 joint venture between ZF Friedrichshafen AG and Foxconn (Hon Hai Technology Group), founded in 2024. With its 25 locations and 3,600 employees worldwide, the actual company stems from a former ZF product line and therefore can draw on 30 years of experience in the field of axle system assembly in a Just in Time/Just in Sequence (JIT/JIS) environment. ZFFCN ensures a global tailor-made full- service approach for the automotive industry by committing to agile project management and close customer proximity. The joint venture provides industrialization, supply chain management, supplier development, and highly integrated assembly operations on global level. For more information about the ZF Foxconn: Corporate website: Home - ZF Foxconn (zffcn.com)

Frankfurt, Taipei, Sep. 5, 2024 -- FIH, a subsidiary of Hon Hai Technology Group (Foxconn), will participate in the world's leading trade fair for the automotive service industry- Automechanika Frankfurt (AMF) 2024 from September 10 to September 14. FIH will unveil its automotive electronic solutions including 4G and 5G Telematics Control Units (TCU), In-Vehicle Infotainment (IVI) system, Smart Cockpit, Advanced Driver Assistance System (ADAS), Zonal Control Unit (ZCU), Power Distribution Center (PDC). As a leading company in the Information and Communications Technology (ICT) industry, FIH has been specially invited to deliver a keynote speech at the "Innovation4Mobility" forum this year. FIH Vice President Dr. Wen Kuo will share how, in the wave of Software-Defined Vehicle (SDV), the ecosystem and supply chain landscape of the traditional automotive industry will be fundamentally transformed, much like how smartphones overturned the entire mobile phones industry. Additionally, he will elaborate on how FIH can rapidly enter the automotive market and successfully apply this expertise to the automotive ecosystem by leveraging years of development and hardware-software integration experience in the ICT field. Dr. Kuo indicates: "Our extensive automotive electronic products exhibited this time integrate core technologies such as wireless communication, cybersecurity, over-the-air (OTA) updates, computing, sensing, in-vehicle information, human-machine interface, and cloud services. This demonstrates FIH's independent design and high-quality manufacturing capabilities in automotive electronic solutions. In the new era of SDV, we see boundless opportunities and endless possibilities for the integration of ICT and the traditional automotive industry. In the future, we look forward to having more in-depth cooperation with global partners to jointly promote the intelligent and electric transformation of the automotive industry." In addition, FIH has also been invited to speak at the "AMF Taiwan Pavilion". Danny Huang, Business Director of FIH's Mobile Vehicle Solution Business Unit, explains: "Taiwan has long played an indispensable and important role in the global electronics industry chain. At this critical time when the automotive industry and its supply chain are undergoing transformation, FIH will not only showcase our technological advantages through this sharing but also explore cooperation opportunities through experience exchange, working hand in hand with Taiwanese manufacturers to explore international markets." In recent years, FIH has actively developed a "2+2" strategy, focusing on emerging industries and technologies such as "automotive electronics, robotics, artificial intelligence, and next-generation communications". In the field of automotive electronics, FIH has quickly entered the market with its excellent communication technology strength and hardware-software integration capabilities. FIH has automotive product production lines with sufficient capacity in multiple countries including Vietnam, Mexico, India, and China. Through global footprint and flexible production strategies, FIH can make real-time dynamic adjustments according to customer needs, meeting the demands of different markets and creating the most competitive automotive electronic solutions for customers. Welcome to visit us at Hall 4.1 E58 at the Frankfurt Exhibition Center in Germany. 2024 Automechanika Frankfurt https://automechanika.messefrankfurt.com/frankfurt/en.html FIH Exhibition Information: ⚫️Dates: September 10 to September 14, 2024 (Tuesday to Saturday) ⚫️Location: Frankfurt Exhibition Center, Germany ⚫️Booth Number: Hall 4.1 E58 FIH Keynote Information: ⚫️Keynote Topic: Over-the-Air Updates: Upgrading and Monitoring Your Vehicle with Technology Borrowed from Smartphones for Smart Cars ⚫️ Time: September 12, 2024, 2:30 PM to 3:00 PM local time (UTC/GMT +2) ⚫️ Location: Frankfurt Exhibition Center, Hall 3   About FIH Mobile Limited FIH Mobile Limited was established in May 2003 and listed on the Hong Kong Stock Exchange in 2005 (Stock Code: 2038.HK). As a subsidiary of Hon Hai Technology Group (Foxconn), FIH Mobile Limited is a leading manufacturer in the global mobile device industry, with over 20 years of experience in integrated hardware and software design and manufacturing across diverse fields such as mobile phones, tablets, smart wearables, smart speakers, and other wireless communication devices and consumer electronics products. In recent years, FIH has been actively developing its “2+2” strategy, leveraging its core capabilities in hardware and software to expand into fields such as automotive electronics, robotics, artificial intelligence, and next-generation communication technologies, achieving significant progress and results. For more information about FIH Mobile Limited, please visit the official website: https://www.fihmobile.com.

City University of Hong Kong (CityUHK) and the Hon Hai Research Institute of the Hon Hai Technology Group (Foxconn) jointly established the Foxconn-CityUHK Joint Research Centre. The aim of the centre is to combine the scientific research efforts of industry and the academic sector to advance innovative research projects in artificial intelligence, semiconductor, next-generation communications, information security and quantum computing.  The opening ceremony of the joint research centre was held on 12 June. Officiating guests included Professor Freddy Boey, President of CityUHK; Dr Lee Wei-bin, Chief Executive Officer and Director of the Information Security Research Centre of the Hong Hai Research Institute; Professor Ma Wei Ying, Huiyan Chair Professor and Chief Scientist of the Institute of AI Industry Research at Tsinghua University; Professor Kuo Tei-wei, Chief Technology Officer, Delta Electronics; Professor Lee Chun-sing, Provost and Deputy President of CityUHK; and Professor Wang Jianping, Associate Provost (Academic Affairs) of CityUHK and Director of the joint research centre, among others. Speaking at the opening ceremony, President Boey said, “We are honoured that CityUHK has been chosen as the first university partner of the Hon Hai Research Institute globally to work together to establish a joint research centre. This collaboration signifies the shared vision of CityUHK and the Hon Hai Research Institute to address the challenges of our times through innovative research. The joint research centre will serve as a collaborative platform for the elites from industry and the academic sector to nurture innovative ideas and advance the development of innovation and technology.” Dr Lee said, “The Hon Hai Research Institute will continue to work closely with CityUHK. We hope that the joint research centre will contribute to breakthroughs in the future development of innovation and technology.” CityUHK representatives and the Hon Hai Research Institute delegation visited the joint research centre after the opening ceremony to conduct further discussions on the future direction of the centre.  Officiating at the opening ceremony of the Foxconn-CityUHK Joint Research Centre are President Boey (third right), Dr Lee (third left), Professor Ma (second left), Professor Kuo (first left), Professor Lee (second right) and Professor Wang (first right). Attending the opening ceremony of the Foxconn-CityUHK Joint Research Centre are President Boey (seventh right), Dr Lee (seventh left), CityUHK representatives and the Hon Hai Research Institute delegation.

[Taipei, June 17, 2024] – Foxconn Interconnect Technology Ltd ("FIT", listed on the Hong Kong Stock Exchange under 6088), a subsidiary of Hon Hai (TW.2317), is expanding its presence in the electric vehicle (EV) sector. Following the acquisition of Germany's SWH Group in 2023 and the launch of the Voltaira brand for its mobility solutions portfolio, FIT Hon Teng has formed a joint venture with XYPower Technology Co., Ltd., establishing FXNWING New Energy Technology Co., Ltd. ("FXNWING") to enter the EV charger market. XY Power, based in Xi'an, specializes in EV charging and energy storage systems. With over 25 years of experience, their expertise in power module design will enhance FXNWING's production capabilities. Combined with FIT Hon Teng's manufacturing strengths, this partnership aims to deliver top-notch charging  and energy restorage solutions globally. With growth potential in the EV market, FIT will continue to partner with core technical experts to leverage business opportunities by shortening development times and enhancing the solution packages. Along with the the One-FIT strategy, the strong cooperation between FXNWING and Voltaira has resulted in a new series called Voltaira AC and DC chargers. The debut product Voltaira Anoles AC charger offer 7kW and 22kW charging power and has won the 2024 IF Product Design Award by featuring its interchangeable covers and easy cable and socket replacement to comply with various international standards. Its modular design and improved heat dissipation make it adaptable to different environments. At Europe’s largest smart energy exhibition, Smarter E Europe, on June 19-21, 2024, visitors were able to explore the Voltaira Royal Series. Targeting the Middle East and North Africa (MENA) market, the Royal Series includes DC fast charging stations and AC chargers for commercial and residential use. Designed for harsh climates, these products feature robust protection and intelligent power distribution to achieve high efficiency and reduce operational costs. FXNWING's innovation is further evidenced by the FitPile,the mini DC which has won a Red Dot Design Award. This recognition highlights FIT Hon Teng's commitment to innovation and technical excellence. Visit us at Messe München, Germany (MESSE) C6.635. About FIT (Foxconn Interconnect Technology) Hon Teng (HK.6088) Foxconn Interconnect Technology (FIT), listed on the Hong Kong Stock Exchange, focuses on precision design and manufacturing of connector products as its core. FIT continues to explore 5G AIoT, EV mobility, and audio applications areas, stepping into consumer brand operations. For more information about FIT, please see: www.fit-foxconn.com. Email: fit-ir@fit-foxconn.com         sales-usa@fit-foxconn.com    

(Taipei, June 02, 2024) As a global pioneer in AI solutions and cloud infrastructure, Ingrasys, a subsidiary of Foxconn Technology Group, today announced that it will showcase its latest AI and data center products, solutions, as well as critical green technologies for enhanced cooling and energy efficiency under the theme of "Next-Gen AI Computing" at Computex Taipei 2024. "AI is accelerating digital transformation across industries," stated Benjamin Ting, President of Ingrasys. "Our AI products and solutions, integrating cutting-edge hardware and software R&D with advanced performance, deliver high-performance, energy-efficient, and scalable offerings to drive green digital transformation and unleash AI's boundless potential." Ingrasys Highlights at Computex 2024: As a pioneering partner in integrating NVIDIA's Blackwell architecture GPUs, Ingrasys unveils the future of next-generation AI data centers by showcasing the latest NVIDIA GB200 NVL72 rack-scale solution. This system supports multi-node and liquid cooling, connecting 72 Blackwell GPUs with 36 Grace CPUs into a single giant GPU, capable of delivering trillion-parameter LLM training and real-time inference.  With the rising demand for enormous AI computing power, the importance of liquid cooling technology has become increasingly evident. Ingrasys showcases advanced liquid cooling solutions, including the liquid-to-air side car solution and the liquid-to-liquid CDU solution, addressing the diverse needs of various data center environments and offering the most comprehensive AI data center solutions. Ingrasys also introduces a series of modular innovations, including self-developed modular servers that support the latest AMD EPYC™ processors and Intel® Xeon® processors, as well as a broad portfolio of 1U/2U/4U NVIDIA MGX™ Systems to meet diverse accelerated computing needs. Additionally, Ingrasys presents the latest liquid-cooled and air-cooled AI accelerators that support different platforms, including NVIDIA HGX™ H200/B100/B200, AMD Instinct™ MI300X platform and Intel® Gaudi® 3 accelerators, offering a wide array of options for optimized performance and flexibility in AI workloads. As Foxconn Technology Group's AI-focused subsidiary, Ingrasys has injected robust momentum into the group's AI and cloud computing businesses. According to Foxconn's Q1 2024 earnings call, AI server revenue nearly doubled year-over-year, with expectations for continued quarter-over-quarter growth. General server demand is also witnessing a sustained rebound, positioning the overall server segment for robust growth. With years of dedication in the AI field, Ingrasys continuously introduces innovative, high-quality products and solutions with rapid development cycles. Leveraging its diversified AI portfolio and profound expertise, Ingrasys maintains close collaboration with partners, jointly contributing to AI technological advancements and driving global industrial digital transformation. We cordially invite you to visit the Ingrasys exhibit to experience our latest AI innovations and engage with our team. Ingrasys at Computex 2024: Dates: June 4 - June 7 Location: Taipei Nangang Exhibition Center, 4F, Booth #L0309a About Ingrasys Ingrasys is a global leading cloud infrastructure pioneer that leverages innovative technologies – including hyperconverged infrastructure, HPC with CDI architecture, AI/ML, and advanced cooling solutions – to meet sophisticated data center needs worldwide. Its extensive product portfolio spans servers, storage, HPC accelerators, workstations, and integrated services. By continuously developing cutting-edge technologies and closely tracking industry trends, Ingrasys fosters long-term partner relationships, delivers exceptional client support, and drives innovation within the hyper-scale cloud ecosystem.

TAIPEI, TAIWAN – March 30, 2024 – The MIH Consortium, since its founding, has swiftly gathered over 2,700 members, establishing itself as a key global platform within the mobility industry. Today, MIH is pleased to announce that Mr. Jun Seki, Foxconn’s Chief Strategy Officer for EVs, will take on the CEO role effective April 1st, 2024. This pivotal change aims to advance industry standardization, unlock new business opportunities, and foster innovation within smart mobility. The Consortium is dedicated to assisting members in entering the electric vehicle and mobility industries, focusing on uniting industry efforts, addressing challenges, and adopting the following strategies: Industry Standards Development: Leveraging Taiwan's Information and Communication Technology (ICT) strengths to join forces with members to define standards for the electric vehicle industry. A Collaborative Platform: Fostering partnerships within our community and with international industry bodies and governments. Offering Targeted Support: Providing support tailored to our members' needs to effectively tackle the challenges of the EV and mobility markets. Expanding Opportunities: Assisting members in exploring global markets and seizing emerging business opportunities. Moving forward, we're dedicated to the principles of sharing, cooperation, and collective prosperity, and to driving innovation and opportunities with members.

[March 25, 2024 - Taipei] AI-generated applications are escalating the demand for higher computing power. In response, Foxconn Interconnect Technology Ltd ("FIT", listed on the Hong Kong Stock Exchange under 6088), a subsidiary of Hon Hai (TW.2317), is joining forces with MediaTek to co-develop a groundbreaking 51.2T solution, inclusive of Co-Packaged Optics (CPO). CPO is designed to revolutionize the integration of optical transceivers by incorporating them directly onto the same package as the ASIC, moving away from traditional separate modules. Building upon the foundation laid by the Red Dot Design Award-winning FITCONN 800G high-speed connector, FIT seeks to further advance its CPO capabilities by utilizing MediaTek's cutting-edge ASIC platform, which includes high-speed SerDes and silicon photonics technologies. Leveraging FIT's adeptness in CPO socket creation and integration capabilities, this collaboration will deliver superior high-performance computing systems tailored for switches within front-end and back-end networks. Within data centers, CPO is instrumental in increasing bandwidth and reducing electrical pathways, thereby improving latency and accelerating data transmission speeds. The architecture's ability to demonstrate significant total system power savings underscores its value and potential. From a connectivity standpoint, CPO enriches FIT's existing optical communication offerings, spanning 800-1600G, and collaborating with MediaTek will enable the evolution of next-generation network communication technologies. "We are deeply honored to partner with MediaTek on this venture. This trailblazing technology is expected to introduce revolutionary products to the market, ensuring stable and reliable high-speed connectivity solutions," said Mr. Joseph Wang, CTO of FIT Hon Teng. "Anticipating the product's launch, we are committed to collectively furnishing our customers with a broader spectrum of efficient connectivity solutions, thereby propelling the high-performance computing era forward." "MediaTek’s vision is to deliver versatile ASIC platforms to clients, providing them with state-of-the-art technologies designed for the rapidly-expanding data center and server markets,” said Vince Hu, Corporate Vice President at MediaTek. “By working together with FIT on the CPO initiative, we will create new market opportunities by enabling and powering next-generation high-speed transmission solutions.” MediaTek is slated to unveil its product lineup, showcasing FIT's CPO socket, in March 2024 at OFC, the premier global event dedicated to optical communication and networking.   About FIT (Foxconn Interconnect Technology) Hon Teng (HK.6088) Foxconn Interconnect Technology (FIT), listed on the Hong Kong Stock Exchange, focuses on precision design and manufacturing of connector products as its core. FIT continues to explore 5G AIoT, EV mobility, and audio applications areas, stepping into consumer brand operations. For more information about FIT, please see: www.fit-foxconn.com.

10G multi-gigabit Automotive Ethernet link to be demonstrated over a 15-meter cable using Broadcom PHY technology. Santa Clara, Calif., January 29, 2024 -- Foxconn Interconnect Technology (6088.HK) (“FIT”), a leading connective solution provider creating powerful connections for a better world, today announced the demonstration of its 10G multi-gigabit Automotive Ethernet cable and connector solutions at the DesignCon 2024 exhibition in Santa Clara, California from January 30th to February 1st. FIT’s FoxNet GII Multi-Gig Automotive Ethernet Connector and Cable will appear together with Broadcom’s 10G PHY Automotive Ethernet Evaluation Board. This demo will feature Broadcom’s BCM89890 multi-gigabit Automotive Ethernet PHY chip, connected with FIT’s 15-meter Foxnet GII Multi-Gig Cable, which includes 4 in-line connectors. This cable link supports the IEEE 802.3ch specification which is rated for 2.5, 5 and 10 Gbps for Automotive Ethernet applications and compliant with OPEN Alliance TC9 standard for Single Pair Ethernet (SPE). The IEEE 802.3ch specification also identifies a maximum length 15-meter cable assembly, with up to 4 in-line connectors. FIT’s FoxNet GII connector and cable family includes (1) Single Port Configuration (as shown in the demo), (2) In-Line Connector Configuration (as shown in the demo), (3) 2x2 (4 port) Connector Configuration, and (4) 1x2 (2port) Connector Configuration. FIT will be conducting a live demonstration of its 10G multi-gigabit Automotive Ethernet link over a 15-meter cable assembly in the FIT Booth #619. This live demo will continuously monitor the bit error rate (BER) across the 15-meter cable length (with 4 in-lines), sending and receiving packets of data continuously. Applications: ‧ Domain Controller, Gateway (Zonal Architecture) ‧ Advanced Driver Assistance Systems ‧ 4D Radar ‧ Lidar ‧ High-resolution 4K Displays ‧ Rear Seat Entertainment ‧ 4K Camera Systems ‧ Intelligent Headlight Protocols Supported: ‧ 100BASE-T1   1000BASE-T1   Multi-Gigabit (2.5, 5 and 10 Gbps ,IEEE 802.3ch) ‧ Beyond 10 Gbps (IEEE 802.3cy) ‧ PCIe (to be optimized), LVDS SerDes (FPD Link, GMSL, Motion Link, MIPI PHYs, HSMT) About FIT Hon Teng Foxconn Interconnect Technology (FIT) is a leading global solutions developer and manufacturer, cultivating connectivity for a better world. With unsurpassed capabilities in development, research, manufacturing engineering and design, production, supply chain, and go-to-market planning for world class brands and private label products spanning B2C and B2B categories, FIT is at the forefront of worldwide technological trends delivering compelling user experiences at scale. With offices and manufacturing sites located in Asia, the Americas and Europe, FIT is a global leader in the manufacturing of high precision interconnect components. For more information, visit FIT’s website: https://www.fit-foxconn.com.