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Hon Hai Tech Day 2024 Opens To Record Attendance Superchip AI Server Capabilities and EV CDMS Strength On Display
2024/10/08
EV

Strong partnerships evident in Foxconn’s 3 smart platforms, clean energy, space

8 October 2024, Taipei, Taiwan – Artificial intelligence was a running theme through Hon Hai Tech Day 2024 on Tuesday as Hon Hai Technology Group (“Foxconn”) (TWSE: 2317) opened its fifth annual flagship technology conference that displayed the first mass-production-ready NVIDIA GB200 NVL72 platform and took to the stage with a slate of partners to demonstrate the space and clean energy ambitions of the world’s largest manufacturing service provider.

Foxconn’s three intelligent platforms – smart manufacturing, smart EV, smart city – received prominent play as keynote speakers in the first day of HHTD24 ranged from leaders such as NVIDIA, Siemens, Bill Gates-backed Breakthrough Energy, GE Vernova from what was formerly General Electric, and one of Europe’s largest space companies, Thales Alenia Space. At the same time, two new reference designs of electric vehicles were unveiled, extending the range of EV models launched since 2021 to a lifestyle multipurpose utility vehicle (LMUV) and a midi electric bus.

“A.I. has accelerated our imagination,” said Foxconn Chairman Young Liu to a packed conference of over 2,000 guests, a record. “This acceleration is coming as Foxconn is transforming. We are re-defining ourselves with our three smart platforms. A.I. is driving our transformation, not for the sake of A.I., but because it makes business sense for Foxconn.”

Deepu Talla, Vice President of Robotics and Edge Computing for NVIDIA, and Benjamin Ting, Senior Vice President for Cloud Enterprise Solutions Business Group at Foxconn, spoke the companies’ strong partnership in AI. With NVIDIA, Foxconn is not only applying Omniverse and AI to enhance its own factories of the future, but also manufacturing energy-efficient AI systems for its customers, including the world’s fastest AI server and rack systems featuring NVIDIA Blackwell.  

The Kaohsiung Super Computing Center was a particular spotlight. Both partners also elaborated on Foxconn’s build out of the world’s largest AI server factory being constructed in Mexico, at more than 400 meters in size, for key customers.

Software, robotics and automation are the genesis of factories of the future, while clean energy means collaborating with like-minded partners to pioneer new technologies, be it in ecosystems for electric vehicles or in energy storage systems (ESS). The on-stage conversations and keynotes also pointed to Foxconn’s collaborations to industrialize space to enhance connectivity on the ground.

Partners who shared insights for the morning session also included Intrinsic, part of Google-parent Alphabet; consulting leader BCG; US battery technology firm Our Next Energy; and renowned Italian design house Pininfarina.

The debut of the MODEL D, as a LMUV, combines the advantages found in SUV and MPV segments. Its styling design was jointly developed with Pininfarina, infusing a sense of harmony to the family of electric vehicles that have been a collaborative work of the Italian and Taiwanese bellwethers.

The MODEL U is universal and intelligent in midi size mobility. The sleek reference design of the midi electric bus continues the innovative design language of the award-winning MODEL T full-sized e-bus launched by Foxconn in 2021. The MODEL U’s internal space can be configured according to needs and with its advanced electronic control system and ADAS system, make the driving experience safer and more comfortable.

The latest models, including the first variant for the MODEL C tailored for the North American market, highlight the range and maturity of Foxconn’s contract design and manufacturing service (CDMS) business model for automotive B2B customers.

The second day of Hon Hai Tech Day, opening to the general public for the first time, is expected to receive more than 8,000 visitors.

For more on Hon Hai Tech Day 2024 here.

About Foxconn here.

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Hon Hai Tech Day 2024 Opens To Record Attendance Superchip AI Server Capabilities and EV CDMS Strength On Display
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Siemens and Foxconn team up to optimize forward-thinking manufacturing
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