Universal scene description technologies to support advanced 3D industrial applications20 November 2024, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) today announced its membership into the Alliance for OpenUSD, supporting the 3D ecosystem in promoting global collaboration for universal scene description.AOUSD, launched in August 2023, is establishing OpenUSD as an international, cross-industry standard with written specifications as part of the new roadmap that will enable greater compatibility and wider adoption, integration, and implementation. Created by Pixar, OpenUSD is a high-performance 3D scene description technology that offers robust interoperability across tools, data, and workflows.“Foxconn’s manufacturing excellence is increasingly incorporating technologies using artificial intelligence and digital twins, requiring 3D industrial applications,” said Dr. Zhe Shi, Foxconn’s Chief Digital Officer and head of its Smart Manufacturing platform. “By partnering with AOUSD, Foxconn can participate in the research and development of related software technologies of our partners and promote the spirit of open source sharing.”AOUSD was founded by Pixar, Adobe, Apple, Autodesk, and NVIDIA, together with the Joint Development Foundation (JDF), an affiliate of the Linux Foundation, and now includes software and hardware bellwethers all aligned to promote the standardization, development, evolution, and growth of Pixar’s Universal Scene Description technology.The AOUSD membership reinforces Foxconn’s commitment to open source and innovation. Foxconn joined the Open Invention Network earlier this year and remains among the Top 100 Global Innovators named by Clarivate. About AOUSDThe Alliance for OpenUSD (AOUSD) is an open organization dedicated to fostering the interoperability of 3D content through OpenUSD (Universal Scene Description) to enable developers and content creators to more easily describe, compose, and simulate large-scale 3D projects. The Alliance brings together a diverse and inclusive community to provide an open forum for collaborative development and discussion around the standardization, development, and growth of OpenUSD.About FoxconnEstablished in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 32nd among the Fortune Global 500. In 2023, revenue totaled TWD6.162 trillion (approx. USD198 billion or EUR183 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and others. The Group operates 205 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – next-generation communications technology, AI, and semiconductors – which are key to driving its long-term growth strategy. It is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises.To learn more, visit www.honhai.com

Companies Showcase Implementation at Taiwan and Mexico Plants19 November 2024, Taipei–Foxconn announced today it is collaborating with NVIDIA to build digital twins to reshape the future of manufacturing processes and supply chain management while opening new pathways for global deployment of advanced facilities and enhancing corporate resilience.This forward-looking partnership first debuted at last year's Hon Hai Tech Day (HHTD23), showcasing Foxconn’s development on the NVIDIA Omniverse platform to create a 3D digital twin to plan and simulate automated production lines at the Taiwan Hsinchu factory. Omniverse adoption at the Hsinchu factory will be scaled out to worldwide Foxconn factories. Meanwhile, advancements in the Mexico factory enable the implementation of NVIDIA Omniverse, NVIDIA Isaac for robotics, NVIDIA Modulus for AI-driven simulations, and OpenUSD for data interoperability.The core advantage of digital twin technology lies in its rapid scalability and simulating processes virtually before deploying in the real world, which has become key to Foxconn's strengthened global deployment. Through this technology, Foxconn can replicate and establish production lines across diverse geographical locations with unprecedented speed and precision. This capability enables Foxconn to swiftly deploy high-quality production facilities with unified standards in strategic markets worldwide, significantly enhancing the company's competitiveness and adaptability in the global landscape.Beyond accelerating Foxconn's global deployment, these digital twin capabilities also significantly enhance the company's resilience. When facing supply chain disruptions or sudden market demands, Foxconn can quickly simulate manufacturing process changes, and adjust production strategies to flexibly allocate resources across different regions for itself and its clients, ensuring production continuity and stability. This high degree of adaptability and flexibility allows Foxconn to maintain a strong competitive advantage in the complex and ever-changing global economic environment.About FoxconnEstablished in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking in the top 32 among the Fortune Global 500. In 2023, revenue totaled TWD6.162 trillion (approx. USD198 billion or EUR183 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and others. The Group operates 205 campuses across 24 countries and is one of the world’s largest employers with over a million employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – next-generation communications technology, AI, and semiconductors – which are key to driving its long-term growth strategy. It is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practices model for global enterprises.To learn more, visit www.honhai.com. 

QunaSys, a leading Japanese innovator in quantum computing software, has announced a strategic partnership with Hon Hai Research Institute, a Taiwanese leader in advanced quantum technology. The collaboration will focus on integrating Hon Hai Research Institute’s advanced Fermionic Encoding methods, a technique that allows for more efficient simulation and manipulation of quantum particles, into QunaSys' quantum toolkit, QURI Parts. This partnership with the institute affiliated with Hon Hai Technology Group (Foxconn), the world’s largest electronics manufacturing service provider, aims to advance the development of quantum algorithms and enhance performance across quantum simulators and computers. The two teams will conduct research on utilizing AI technologies to improve and refine Hon Hai Research Institute’s Fermionic Encoding methods, driving forward innovation in quantum simulation. This groundbreaking research is expected to result in new methodologies and algorithms that will accelerate advancements in quantum computing. By integrating these new methods into QURI Parts, the partnership aims to make quantum simulations—especially those involving complex systems—more accurate and efficient. The upgraded toolkit will offer users powerful new features, smoothly working with other parts of QURI Parts to maximize performance across both quantum simulations and actual quantum computers. This collaboration represents a significant step forward for both QunaSys and Hon Hai  Research Institute, not only in the development of quantum software but also in the expansion of research and development capabilities. Both parties are committed to fostering innovation, sharing knowledge, and driving new discoveries that will benefit the entire quantum computing ecosystem. "This partnership underscores our commitment to pushing the boundaries of quantum coding and software,” said Tennin Yan, CEO of QunaSys. “By working closely with Hon Hai Research Institute, we are combining our strengths to unlock new possibilities and deliver cutting-edge solutions that will shape the future of quantum technology." Min-Hsiu Hsieh, Director of the Quantum Computing Research Center at the Hon Hai Research Institute, said: "Partnering with QunaSys allows us to bring our Fermionic Encoding methods to a wider audience while simultaneously pushing the boundaries of what’s possible through collaborative research on Neural Networks."   About QURI Parts QURI Parts is QunaSys' open-source library suite for creating and executing quantum algorithms on a variety of quantum computers and simulators. The library provides modular components that allow users to easily assemble their own algorithms or modify existing ones by swapping subcomponents. Once built, the algorithms can be executed on various quantum platforms without changing the core algorithm code. A standout feature of QURI Parts is its focus on computational performance, making it possible to extract maximum efficiency from quantum simulators. By offering flexibility, power, and ease of use, QURI Parts empowers developers and researchers alike to accelerate quantum innovation.

Vietnam's 1st Lighthouse Factory, China Achieves 1st Sustainable Lighthouse Certification 11 October 2024, Taipei, Taiwan – The World Economic Forum (WEF) has recognized two more Hon Hai Technology Group (“Foxconn”) (TWSE:2317) facilities as Lighthouse factories. Subsidiary Foxconn Industrial Internet's Bac Giang Province facility becomes Vietnam's first Lighthouse factory, while the Guanlan factory in Shenzhen, China, is certified as Foxconn's first Sustainable Lighthouse. These additions bring the Group's total Lighthouse factories to eight*, underscoring the smart and sustainable leadership of the world’s largest electronics manufacturing service provider. The Vietnam and China factories, recognized by the WEF, showcase the compatibility of efficient manufacturing and sustainability. Through AI and digitalization, these facilities boost production efficiency while reducing environmental impact. This model will be implemented across Foxconn's global base, advancing smart manufacturing and supporting industry-wide digital transformation. Kiva Allgood, Head of the World Economic Forum's Centre for Advanced Manufacturing and Supply Chains, highlighted the significance of these developments: "These sites are integrating advanced technologies into their operations, not just to enhance productivity, but to create a sustainable and inclusive future for their workforce and the broader community." AI and Vietnam's First National Smart Lighthouse Factory The Vietnam factory, now the country's first national Lighthouse factory, provides valuable insights for multinational companies in global deployment. WEF's evaluation noted: “In its global expansion for supply chain resilience, Fii Vietnam overcame initial challenges such as heavy reliance on imported materials and [met] the opportunity to develop local talent. By implementing 40+ 4IR use cases, including advanced planning and AI-driven automation, the site improved labour productivity by 190%, achieved 99.5% on-time delivery and cut manufacturing costs by 45%..." Vietnam's first WEF Lighthouse factory integrates AI, IoT, and big data for end-to-end management, boosting efficiency. Five key technologies enable a flexible production model, addressing cross-border challenges and meeting global demands for diverse, small-batch production. Michael Wang, Vietnam factory's strategy development manager, emphasized that Lighthouse factories primarily enhance operational resilience. By building an interconnected system domestically and internationally, companies can quickly adapt to various setups, improve global supply chain management and production efficiency, and effectively address challenges in multinational operations. AI and the First Sustainable Lighthouse Factory WEF states: "To meet the consumer electronics industry's commitment to carbon neutrality, Foxconn Industrial Internet Shenzhen utilized AI, Internet of Things (IoT) and other 4IR technologies to optimize recycling, track carbon footprints and innovate for sustainability. This led to a 42% reduction in Scope 3 emissions, a 24% cut in Scope 1 and 2 emissions, and increased recycled material content to 55%-75%." Wu Yanru, the sustainable Lighthouse project lead, emphasized that advanced technologies balance production quality with sustainability. For example, AI applications in anodizing ensure both operational efficiency and environmental management. AI-driven innovation is now central to Foxconn's sustainability strategy. The Guanlan factory's advanced implementations, including IoT-supported carbon footprint optimization and AI-driven circular processes, have become valuable tools for improving quality, efficiency, and reducing emissions across various production lines.   About Foxconn here.   *Note: The "Lighthouse Factory" designation is conferred by the World Economic Forum (WEF) through a rigorous selection process based on multiple indicators. Selected factories represent the pinnacle of global smart manufacturing and digital operations. The Vietnam and Guanlan factories join Foxconn Technology Group's existing Lighthouse factories: Shenzhen Longhua (2019/01), Zhengzhou (2021/09), Wuhan (2019/09), Chengdu (2021/03), Shenzhen Guanlan (2023/01), and Taoyuan Nanqing Factory (2023/12).

Strong partnerships evident in Foxconn’s 3 smart platforms, clean energy, space 8 October 2024, Taipei, Taiwan – Artificial intelligence was a running theme through Hon Hai Tech Day 2024 on Tuesday as Hon Hai Technology Group (“Foxconn”) (TWSE: 2317) opened its fifth annual flagship technology conference that displayed the first mass-production-ready NVIDIA GB200 NVL72 platform and took to the stage with a slate of partners to demonstrate the space and clean energy ambitions of the world’s largest manufacturing service provider. Foxconn’s three intelligent platforms – smart manufacturing, smart EV, smart city – received prominent play as keynote speakers in the first day of HHTD24 ranged from leaders such as NVIDIA, Siemens, Bill Gates-backed Breakthrough Energy, GE Vernova from what was formerly General Electric, and one of Europe’s largest space companies, Thales Alenia Space. At the same time, two new reference designs of electric vehicles were unveiled, extending the range of EV models launched since 2021 to a lifestyle multipurpose utility vehicle (LMUV) and a midi electric bus. “A.I. has accelerated our imagination,” said Foxconn Chairman Young Liu to a packed conference of over 2,000 guests, a record. “This acceleration is coming as Foxconn is transforming. We are re-defining ourselves with our three smart platforms. A.I. is driving our transformation, not for the sake of A.I., but because it makes business sense for Foxconn.” Deepu Talla, Vice President of Robotics and Edge Computing for NVIDIA, and Benjamin Ting, Senior Vice President for Cloud Enterprise Solutions Business Group at Foxconn, spoke the companies’ strong partnership in AI. With NVIDIA, Foxconn is not only applying Omniverse and AI to enhance its own factories of the future, but also manufacturing energy-efficient AI systems for its customers, including the world’s fastest AI server and rack systems featuring NVIDIA Blackwell.   The Kaohsiung Super Computing Center was a particular spotlight. Both partners also elaborated on Foxconn’s build out of the world’s largest AI server factory being constructed in Mexico, at more than 400 meters in size, for key customers. Software, robotics and automation are the genesis of factories of the future, while clean energy means collaborating with like-minded partners to pioneer new technologies, be it in ecosystems for electric vehicles or in energy storage systems (ESS). The on-stage conversations and keynotes also pointed to Foxconn’s collaborations to industrialize space to enhance connectivity on the ground. Partners who shared insights for the morning session also included Intrinsic, part of Google-parent Alphabet; consulting leader BCG; US battery technology firm Our Next Energy; and renowned Italian design house Pininfarina. The debut of the MODEL D, as a LMUV, combines the advantages found in SUV and MPV segments. Its styling design was jointly developed with Pininfarina, infusing a sense of harmony to the family of electric vehicles that have been a collaborative work of the Italian and Taiwanese bellwethers. The MODEL U is universal and intelligent in midi size mobility. The sleek reference design of the midi electric bus continues the innovative design language of the award-winning MODEL T full-sized e-bus launched by Foxconn in 2021. The MODEL U’s internal space can be configured according to needs and with its advanced electronic control system and ADAS system, make the driving experience safer and more comfortable. The latest models, including the first variant for the MODEL C tailored for the North American market, highlight the range and maturity of Foxconn’s contract design and manufacturing service (CDMS) business model for automotive B2B customers. The second day of Hon Hai Tech Day, opening to the general public for the first time, is expected to receive more than 8,000 visitors. For more on Hon Hai Tech Day 2024 here. About Foxconn here.

MODEL C, after AXCR debut and first variant, highlights CDMS strength 8 October 2024, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE: 2317), the world's largest technology manufacturer and service provider, announced two, new reference electric vehicles at the fifth annual Hon Hai Tech Day (HHTD), extending its automotive range with the MODEL D, a lifestyle multipurpose utility vehicle, and the MODEL U, a midi-sized electric bus. At the same time, Foxtron Vehicle Technologies, the publicly-listed Foxconn subsidiary responsible for the newly unveiled reference designs, also showcased the first variant of the MODEL C for automotive OEM customers interested in the North American market.   “The latest models join a terrific line-up of EVs displaying our range and maturity in automotive development,” said Young Liu, Chairman of Hon Hai Technology Group (Foxconn). “The EVs going to market with our B2B customers are standing up to real tests in automotive endurance, safety and reliability.” MODEL D is Lifestyle Multipurpose Utility Vehicle The MODEL D is based on the design concept of LMUV (Lifestyle Multipurpose Utility Vehicle) and combines the advantages found in SUV and MPV segments. It is a multi-functional hybrid model and adopts Foxconn’s latest generation platform technology. The MODEL D is 5.2 meters long and has a wheelbase of 3.2 meters, providing a spacious and comfortable seating space. It is equipped with a pneumatic suspension system to improve driving stability. The active suspension allows the height to be adjusted by 15 mm to 25 mm. The body design incorporates S-ducts and air curtains specially designed to reduce wind resistance, bringing the drag coefficient to a low 0.23. The MODEL D’s styling design was jointly developed with renowned Italian design house Pininfarina SpA, infusing a sense of harmony to the family of electric vehicles that have been a collaborative work of the Italian and Taiwanese bellwethers. MODEL U is universal and intelligent in midi size mobility The MODEL U, a new, midi-sized electric bus, continues the innovative design language of the award-winning MODEL T full-sized electric bus launched by Foxconn in 2021. Specially designed for narrow urban lanes and remote areas, the MODEL U’s clean and simple appearance with large windows also emphasizes flexibility and multi-functionality. The body size is moderate, and the internal space can be configured according to needs. Its advanced electronic control system and ADAS system make the driving experience safer and more comfortable. At the same time, the car body structure and aerodynamic design are optimized to achieve longer endurance. MODEL C highlights CDMS capabilities for North American market On Hon Hai Tech Day, the North American variant of the MODEL C, created in cooperation with American partners, was officially unveiled and is expected to be in mass production by the end of 2025. It maintains a simple and fashionable new-generation family style, expanding the S-duct design, new styling and steering wheel, and launching a new user interface (UI) design. The MODEL C, a family SUV that first debuted in 2021, has become one of the best-selling passenger EVs in the Taiwan market following uptake as the “n7” brand of Taiwanese customer Luxgen. In August, the MODEL C was souped up for success as the first ever EV entrant in the 2,100 km Asia Cross Country Rally (AXCR), which is Southeast Asia’s largest motorsport rally. The achievements of the MODEL C are a testament to Foxconn’s Contract Design and Manufacturing Service (CDMS) business model that invites automotive OEM customers to choose their favorite reference designs to customize their cars. Under the modular platform, hardware modules are flexibly combined and the software-defined EE architecture is continuously updated to improve the user experience through software updates.

Deepens collaboration, drives intelligent ecosystems 4 June 2024, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) today announced that it plans to build an advanced computing center in Kaohsiung, Taiwan, with the NVIDIA Blackwell platform at its core, as the CEOs of the two technology bellwethers reaffirmed their strong partnership at COMPUTEX 2024. The latest collaboration between Foxconn and NVIDIA signals a deepening commitment by the world’s largest electronics manufacturing service provider and market leader in making AI servers, alongside its world-class partner, to drive intelligent ecosystems covering AI, electric vehicles, smart factories, robotics, smart cities and other fields. NVIDIA founder and CEO Jensen Huang and Foxconn Chairman and CEO Young Liu caught up with each other on the exhibition floor of COMPUTEX, getting a comprehensive tour about their cooperation at the booth set up by Ingrasys, the Foxconn subsidiary that has been at the manufacturing epicenter of NVIDIA’s GB200 NVL72, MGX, HGX and other innovative products. Following the tour, Huang noted that NVIDIA and Foxconn have worked closely together on various product development, and the proof of the cooperation is clear, especially with the Blackwell product line-up; Foxconn has excellent vertical integration capabilities and is a vital partner for the GB200. On the spot, Chairman Liu announced that Foxconn will join hands with NVIDIA to build an advanced computing center in Kaohsiung with the NVIDIA Blackwell platform at its core. The cutting-edge computing center, anchored by the superchip GB200 servers, consists of a total of 64 racks and 4,608 GPUs, is slated for completion by 2026. NVIDIA’s powerful AI technology will drive Foxconn’s three smart platforms: Smart Manufacturing. Smart EV. Smart City. Both companies will continue to deepen cooperation in AI, electric vehicles, smart factories, robots, smart cities and other fields, and demonstrate the strong competitiveness brought by AI through Foxconn’s huge manufacturing scale. Huang said, “A new era of computing has dawned, fueled by surging global demand for generative AI data centers. Foxconn stands at the forefront as a leading supplier of NVIDIA computing and a trailblazer in the application of generative AI in manufacturing and robotics. Leveraging NVIDIA Omniverse and Isaac robotics platforms, Foxconn is harnessing cutting-edge AI and digital twin technologies to construct their advanced computing center in Kaohsiung.” The two companies will utilize NVIDIA Omniverse and create digital twins to introduce platforms for smart manufacturing, smart electric vehicles, and smart cities. For smart manufacturing platforms, image recognition technology, combined with the Group's autonomous mobile robots (AMR), will lead to changes for optimal capacity utilization. The production line planning will encompass existing manufacturing of AI servers and EV assembly plants. Toward that goal, the new Qiaotou automotive manufacturing facilities of Foxtron, a Foxconn subsidiary, will become one of the Group's benchmark AI factories. Currently under construction, the site will utilize digital twin connected to cloud technologies and achieve collaboration between virtual and physical production lines. Digital real-time monitoring will ensure the manufacturing excellence of an award-winning electric bus, which is currently seeing orders outpacing output capacity.  Going forward, the two companies’ collaborative effort in EV ADAS platform will be applied to future EV models designed by Foxconn. Presently, Foxconn is negotiating projects with traditional European and American automakers. Moreover, based on NVIDIA's new generation of chips, Foxconn and NVIDIA jointly plan a "cabin-driving-in-one" smart travel solution, creating a third living space. Centering on the smart city platform being created in Kaohsiung, the two companies will also work with ecosystem partners to make generative AI applications a reality. This plan is in addition to the advanced computing center to be jointly built by Foxconn and NVIDIA. Currently, the Group has supported the Kaohsiung City Government in introducing smart public transportation management. In the future, efforts will introduce generative AI technology in the fields of digital governance and medical health to benefit local residents, government, enterprises and visiting tourists.

- Siemens and Foxconn sign memorandum of understanding (MoU), highlighting joint sustainability commitment - Cooperation to define standards for the factory of the future and for manufacturing processes - Innovations to positively impact information and communications technology and electric-vehicle production ecosystems  - Siemens Xcelerator portfolio to optimize Foxconn’s operations for efficiency and agility Siemens AG, a leading technology company, and Hon Hai Technology Group (Foxconn) (TWSE:2317), the world’s largest electronics manufacturer, have signed a memorandum of understanding (MoU) to drive digital transformation and sustainability in smart manufacturing platforms.  The collaboration focuses on global manufacturing processes in electronics, information and communications technology, and electric vehicles (EV). Siemens and Foxconn are working together to establish a scalable and seamless engineering and manufacturing ecosystem. Roland Busch, President and CEO of Siemens AG, emphasized the significance of this partnership: “At Siemens, we believe in the power of partnerships to drive positive change. Our collaboration with Foxconn underscores our commitment to innovation and sustainability as we work together to shape the future of electronics manufacturing.” Young Liu, Chairman and CEO of Hon Hai Technology Group (Foxconn), said: “Foxconn is transforming into a platform solutions provider for smart manufacturing, smart EVs and smart cities. Joining forces with Siemens accelerates our digital transformation journey and opens up new possibilities for innovation and sustainability.” This MoU identifies key collaboration areas to increase the automation level at Foxconn’s facilities. These areas include electronics manufacturing service (EMS) and contract design and manufacturing service (CDMS), which is Foxconn’s innovative business model for electric vehicles. Both companies will explore initiatives to work toward the factory of the future by implementing Siemens’ leading factory automation portfolio and industrial software, which include building blocks such as digital twin technology and artificial intelligence (AI). Siemens Xcelerator, with its comprehensive suite of software and solutions, will play a pivotal role in optimizing Foxconn’s engineering and manufacturing workflows, facilitating efficiency and agility across its operations. This collaboration aims to leverage how Siemens’ technical expertise can enhance Foxconn’s sustainability performance, contributing to energy savings and a reduced CO2 footprint. This partnership involves establishing transparent monitoring processes and applying professional services and digital solutions because both companies are working toward a greener future for electronics manufacturing. “Electronics are the backbone of modern society, powering everything from communication to transportation. We are, therefore, very proud to intensify our collaboration with Foxconn,” said Cedrik Neike, CEO of Digital Industries and member of the Managing Board of Siemens AG. “With Siemens’ domain knowhow and leading portfolio in factory automation and software, we’ll accelerate the transformation of the electronics manufacturing industry and support Foxconn to not only achieve its sustainability targets, but also improve efficiency.”  Dr. Zhe Shi, Foxconn’s Chief Digital Officer and head of its Smart Manufacturing platform, added: “Siemens is a leader in providing digital transformation solutions. Our deepening collaboration to build the factory of the future in the AI era will enable us to provide topflight manufacturing service to all our customers.” 

*As of April 30, 2024, Foxconn acquires 50 percent of the shares in ZF Chassis Modules GmbH *Strategic partnership strengthens mutual cooperation, business growth and expansion of the customer base  *Partners explore further fields of innovation   01.05.2024 Friedrichshafen/Taipei. ZF Friedrichshafen AG, one of the world's largest automotive suppliers, and Hon Hai Technology Group ("Foxconn", TWSE: 2317), the world's largest electronics manufacturer, have completed the establishment of their joint venture in the field of passenger car chassis systems on April 30. The acquisition of a 50-percent stake in ZF Chassis Modules GmbH by Foxconn achieves a 50-50 partnership, which was agreed upon on July 24, 2023, and approved by regulators. The new joint venture, called ZF Foxconn Chassis Modules, is a central element in the future strategy of both shareholders. Through the partnership, ZF Friedrichshafen AG secures resources for profitable growth, new customer access and additional development fields beyond the growing core market of axle system assembly. For Foxconn, the acquisition of a 50-percent stake in ZF Chassis Modules GmbH, with a total enterprise value of around €1 billion (around $1.1 billion), opens up new perspectives in the automotive sector. The joint venture will use core competencies and process expertise from existing business areas and jointly develop them for new markets.     "ZF and Foxconn complement each other perfectly in this joint venture," affirms Dr. Holger Klein, Chairman of the Board of Management of ZF Friedrichshafen AG. "It uniquely combines engineering competence, agility, know-how and customer orientation on a global scale. This secures our presence in today’s growth segments and paves the way to engage in future markets. Together, we will meet the needs of existing and new customers in an even more targeted manner and bring innovative technologies to series production."     "I am very pleased about the partnership that has been sealed today. Foxconn's global network and supply chain management expertise will have a positive impact on the growth strategies of our two companies," said Young Liu, Chairman and CEO of Foxconn. "We are very interested in opening up further partnership opportunities in the transportation and mobility sector with ZF Foxconn Chassis Modules."    The joint venture, which is headed by the two experienced ZF executives Eike Dorff (CEO) and Urs Rienhoff (CFO), strives to take advantage of expansion opportunities in the global market for axle system assembly. It aims to achieve the greatest possible adaptation to markets and contractual partners through continuous process optimization. The enterprise value of the ZF division is around €1 billion (around $1.1 billion). ZF Foxconn Chassis Modules GmbH supplies global premium and volume manufacturers and is represented at 25 locations worldwide. The company employs approximately 3,800 people, almost 100 of whom are based in Germany. The division's sales for 2023 amounted to roughly €4.3 billion ($4.7 billion).  Dr. Holger Klein, Chairman of the Board of Management of ZF Friedrichshafen AG (left), and Young Liu, Chairman and CEO of Hon Hai Technology Group (Foxconn), with the brand logo of the new joint venture ZF Foxconn Chassis Modules.  Picture credits: ZF  About ZF  ZF is a global technology company supplying advanced mobility products and systems for passenger cars, commercial vehicles and industrial technology. Its comprehensive product range is primarily aimed at vehicle manufacturers, mobility providers and start-up companies in the fields of transportation and mobility. ZF electrifies a wide range of vehicle types. With its products, the company contributes to reducing emissions, protecting the climate as well as enhancing safe mobility. Alongside the automotive sector – passenger cars and commercial vehicles – ZF also serves market segments such as construction and agricultural machinery, wind power, marine propulsion, rail drives and test systems. With some 168,700 employees worldwide, ZF reported sales of €46.6 billion in fiscal 2023. The company operates 162 production locations in 31 countries. Please find more information on: www.zf.com

Foxconn’s Investment helps Indigo accelerate its breakthrough Smart EVs with superior user experiences and sustainable unit economics for fleets, businesses and transportation companies Boston, MA --(BUSINESS WIRE)— March 25, 2024— Indigo Technologies, a robotics focused Smart EV OEM with breakthrough road sensing SmartWheels™ invented by team out of MIT, today announced it has received a strategic investment from Hon Hai Technology Group (Foxconn). The investment, which recently gained regulatory approval after being first announced late last year, accelerates Indigo, the US automotive tech innovator in its development of smart, smooth and efficient light utility EVs designed for sustainable ride hail, delivery and autonomous transportation services. Indigo EVs will help transportation network companies (TNC) and delivery network companies (DNC), fleet management companies (FMC) and the millions of businesses, taxi drivers and gig economy work force to become more profitable while driving to a more sustainable future. “Our cities, citizens and businesses need affordable and desirable EVs that improve safety, utility and comfort,” says Will Graylin, CEO of Indigo. “We are thrilled to be partnering with Foxconn on the mission to create technology for smart living and deliver the next generation of lighter, more cost effective EVs for sustainable mobility at scale. Foxconn’s Chief Strategy Officer for Electric Vehicles Mr. Jun Seki, who was former CEO of Nidec and COO of Nissan, joins Indigo’s Board of Directors adding further innovation depth and global supply chain connections as we launch vehicles in 2025”. According to Foxconn, this will support the vision to turn an MIT invention into a global innovation with commercial adoption.  Partnered with the largest TNCs, DNCs and FMCs, Indigo’s EV software and hardware solutions with TaaS Transport-as-a-Service package will include fleet transport operations and manage autonomous fleet mobility on public roads. Indigo invented the world’s only road sensing SmartWheels™, robotics hardware and software that fully integrates drivetrain and suspension as a tech package, to enable a whole new vehicle architecture, making lighter, more efficient EVs feel incredibly smooth and stable, yet more roomy and affordable. Indigo first SmartWheels™ powered EVs, the FLOW, will have more usable cabin space, a lower flat floor, a smoother ride experience and better unit economics than any vehicle of its class. The FLOW will have 180 cubic feet of space, approximately 200 miles of range, priced near $37K and is expected to hit the roads of America late 2026. Indigo will also deliver a smaller Smart EV called the DASH with the latest telematics and sensors connected to its cloud software to help fleets lower risks and total-cost-of-ownership while improving service experiences. The DASH will have 90 cubic feet of space, 140 miles of range, priced near $27K and will be in trial 2H 2024, with volume delivery early 2025.  About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking in the top 30 among the Fortune Global 500. In 2023, revenue totaled TWD6.162 trillion (approx. USD198 billion or EUR183 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and others. The Group operates 205 campuses across 24 countries and is one of the world’s largest employers with over a million employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – next-generation communications technology, AI, and semiconductors – which are key to driving its long-term growth strategy. It is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practices model for global enterprises. To learn more, visit www.honhai.com     About Indigo Tech Indigo is the only Smart EV OEM with patented road sensing robotic SmartWheels™ EVs with roomier, smoother and safer rides for people and fleets at a price they can afford. We are building a whole new class of ultra-efficient EVs designed from the wheels up focused on user experience and unit economics. Indigo Smart EVs are designed first for ride hail and delivery applications, and will expand later towards consumer Smart EVs with possibilities to license its technology to other OEMs.  Indigo SmartWheels™ powered EVs will have the largest interior space, smoothest and best ride quality, and lowest cost-per-mile of any vehicle in its class.        Indigo is working with fleets, TNCs, DNCs and Transportation-as-a-Service (TaaS) companies, to proliferate sustainable, desirable and affordable transportation for all. www.indigotech.com