Deepens collaboration, drives intelligent ecosystems 4 June 2024, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) today announced that it plans to build an advanced computing center in Kaohsiung, Taiwan, with the NVIDIA Blackwell platform at its core, as the CEOs of the two technology bellwethers reaffirmed their strong partnership at COMPUTEX 2024. The latest collaboration between Foxconn and NVIDIA signals a deepening commitment by the world’s largest electronics manufacturing service provider and market leader in making AI servers, alongside its world-class partner, to drive intelligent ecosystems covering AI, electric vehicles, smart factories, robotics, smart cities and other fields. NVIDIA founder and CEO Jensen Huang and Foxconn Chairman and CEO Young Liu caught up with each other on the exhibition floor of COMPUTEX, getting a comprehensive tour about their cooperation at the booth set up by Ingrasys, the Foxconn subsidiary that has been at the manufacturing epicenter of NVIDIA’s GB200 NVL72, MGX, HGX and other innovative products. Following the tour, Huang noted that NVIDIA and Foxconn have worked closely together on various product development, and the proof of the cooperation is clear, especially with the Blackwell product line-up; Foxconn has excellent vertical integration capabilities and is a vital partner for the GB200. On the spot, Chairman Liu announced that Foxconn will join hands with NVIDIA to build an advanced computing center in Kaohsiung with the NVIDIA Blackwell platform at its core. The cutting-edge computing center, anchored by the superchip GB200 servers, consists of a total of 64 racks and 4,608 GPUs, is slated for completion by 2026. NVIDIA’s powerful AI technology will drive Foxconn’s three smart platforms: Smart Manufacturing. Smart EV. Smart City. Both companies will continue to deepen cooperation in AI, electric vehicles, smart factories, robots, smart cities and other fields, and demonstrate the strong competitiveness brought by AI through Foxconn’s huge manufacturing scale. Huang said, “A new era of computing has dawned, fueled by surging global demand for generative AI data centers. Foxconn stands at the forefront as a leading supplier of NVIDIA computing and a trailblazer in the application of generative AI in manufacturing and robotics. Leveraging NVIDIA Omniverse and Isaac robotics platforms, Foxconn is harnessing cutting-edge AI and digital twin technologies to construct their advanced computing center in Kaohsiung.” The two companies will utilize NVIDIA Omniverse and create digital twins to introduce platforms for smart manufacturing, smart electric vehicles, and smart cities. For smart manufacturing platforms, image recognition technology, combined with the Group's autonomous mobile robots (AMR), will lead to changes for optimal capacity utilization. The production line planning will encompass existing manufacturing of AI servers and EV assembly plants. Toward that goal, the new Qiaotou automotive manufacturing facilities of Foxtron, a Foxconn subsidiary, will become one of the Group's benchmark AI factories. Currently under construction, the site will utilize digital twin connected to cloud technologies and achieve collaboration between virtual and physical production lines. Digital real-time monitoring will ensure the manufacturing excellence of an award-winning electric bus, which is currently seeing orders outpacing output capacity.  Going forward, the two companies’ collaborative effort in EV ADAS platform will be applied to future EV models designed by Foxconn. Presently, Foxconn is negotiating projects with traditional European and American automakers. Moreover, based on NVIDIA's new generation of chips, Foxconn and NVIDIA jointly plan a "cabin-driving-in-one" smart travel solution, creating a third living space. Centering on the smart city platform being created in Kaohsiung, the two companies will also work with ecosystem partners to make generative AI applications a reality. This plan is in addition to the advanced computing center to be jointly built by Foxconn and NVIDIA. Currently, the Group has supported the Kaohsiung City Government in introducing smart public transportation management. In the future, efforts will introduce generative AI technology in the fields of digital governance and medical health to benefit local residents, government, enterprises and visiting tourists.

- Siemens and Foxconn sign memorandum of understanding (MoU), highlighting joint sustainability commitment - Cooperation to define standards for the factory of the future and for manufacturing processes - Innovations to positively impact information and communications technology and electric-vehicle production ecosystems  - Siemens Xcelerator portfolio to optimize Foxconn’s operations for efficiency and agility Siemens AG, a leading technology company, and Hon Hai Technology Group (Foxconn) (TWSE:2317), the world’s largest electronics manufacturer, have signed a memorandum of understanding (MoU) to drive digital transformation and sustainability in smart manufacturing platforms.  The collaboration focuses on global manufacturing processes in electronics, information and communications technology, and electric vehicles (EV). Siemens and Foxconn are working together to establish a scalable and seamless engineering and manufacturing ecosystem. Roland Busch, President and CEO of Siemens AG, emphasized the significance of this partnership: “At Siemens, we believe in the power of partnerships to drive positive change. Our collaboration with Foxconn underscores our commitment to innovation and sustainability as we work together to shape the future of electronics manufacturing.” Young Liu, Chairman and CEO of Hon Hai Technology Group (Foxconn), said: “Foxconn is transforming into a platform solutions provider for smart manufacturing, smart EVs and smart cities. Joining forces with Siemens accelerates our digital transformation journey and opens up new possibilities for innovation and sustainability.” This MoU identifies key collaboration areas to increase the automation level at Foxconn’s facilities. These areas include electronics manufacturing service (EMS) and contract design and manufacturing service (CDMS), which is Foxconn’s innovative business model for electric vehicles. Both companies will explore initiatives to work toward the factory of the future by implementing Siemens’ leading factory automation portfolio and industrial software, which include building blocks such as digital twin technology and artificial intelligence (AI). Siemens Xcelerator, with its comprehensive suite of software and solutions, will play a pivotal role in optimizing Foxconn’s engineering and manufacturing workflows, facilitating efficiency and agility across its operations. This collaboration aims to leverage how Siemens’ technical expertise can enhance Foxconn’s sustainability performance, contributing to energy savings and a reduced CO2 footprint. This partnership involves establishing transparent monitoring processes and applying professional services and digital solutions because both companies are working toward a greener future for electronics manufacturing. “Electronics are the backbone of modern society, powering everything from communication to transportation. We are, therefore, very proud to intensify our collaboration with Foxconn,” said Cedrik Neike, CEO of Digital Industries and member of the Managing Board of Siemens AG. “With Siemens’ domain knowhow and leading portfolio in factory automation and software, we’ll accelerate the transformation of the electronics manufacturing industry and support Foxconn to not only achieve its sustainability targets, but also improve efficiency.”  Dr. Zhe Shi, Foxconn’s Chief Digital Officer and head of its Smart Manufacturing platform, added: “Siemens is a leader in providing digital transformation solutions. Our deepening collaboration to build the factory of the future in the AI era will enable us to provide topflight manufacturing service to all our customers.” 

*As of April 30, 2024, Foxconn acquires 50 percent of the shares in ZF Chassis Modules GmbH *Strategic partnership strengthens mutual cooperation, business growth and expansion of the customer base  *Partners explore further fields of innovation   01.05.2024 Friedrichshafen/Taipei. ZF Friedrichshafen AG, one of the world's largest automotive suppliers, and Hon Hai Technology Group ("Foxconn", TWSE: 2317), the world's largest electronics manufacturer, have completed the establishment of their joint venture in the field of passenger car chassis systems on April 30. The acquisition of a 50-percent stake in ZF Chassis Modules GmbH by Foxconn achieves a 50-50 partnership, which was agreed upon on July 24, 2023, and approved by regulators. The new joint venture, called ZF Foxconn Chassis Modules, is a central element in the future strategy of both shareholders. Through the partnership, ZF Friedrichshafen AG secures resources for profitable growth, new customer access and additional development fields beyond the growing core market of axle system assembly. For Foxconn, the acquisition of a 50-percent stake in ZF Chassis Modules GmbH, with a total enterprise value of around €1 billion (around $1.1 billion), opens up new perspectives in the automotive sector. The joint venture will use core competencies and process expertise from existing business areas and jointly develop them for new markets.     "ZF and Foxconn complement each other perfectly in this joint venture," affirms Dr. Holger Klein, Chairman of the Board of Management of ZF Friedrichshafen AG. "It uniquely combines engineering competence, agility, know-how and customer orientation on a global scale. This secures our presence in today’s growth segments and paves the way to engage in future markets. Together, we will meet the needs of existing and new customers in an even more targeted manner and bring innovative technologies to series production."     "I am very pleased about the partnership that has been sealed today. Foxconn's global network and supply chain management expertise will have a positive impact on the growth strategies of our two companies," said Young Liu, Chairman and CEO of Foxconn. "We are very interested in opening up further partnership opportunities in the transportation and mobility sector with ZF Foxconn Chassis Modules."    The joint venture, which is headed by the two experienced ZF executives Eike Dorff (CEO) and Urs Rienhoff (CFO), strives to take advantage of expansion opportunities in the global market for axle system assembly. It aims to achieve the greatest possible adaptation to markets and contractual partners through continuous process optimization. The enterprise value of the ZF division is around €1 billion (around $1.1 billion). ZF Foxconn Chassis Modules GmbH supplies global premium and volume manufacturers and is represented at 25 locations worldwide. The company employs approximately 3,800 people, almost 100 of whom are based in Germany. The division's sales for 2023 amounted to roughly €4.3 billion ($4.7 billion).  Dr. Holger Klein, Chairman of the Board of Management of ZF Friedrichshafen AG (left), and Young Liu, Chairman and CEO of Hon Hai Technology Group (Foxconn), with the brand logo of the new joint venture ZF Foxconn Chassis Modules.  Picture credits: ZF  About ZF  ZF is a global technology company supplying advanced mobility products and systems for passenger cars, commercial vehicles and industrial technology. Its comprehensive product range is primarily aimed at vehicle manufacturers, mobility providers and start-up companies in the fields of transportation and mobility. ZF electrifies a wide range of vehicle types. With its products, the company contributes to reducing emissions, protecting the climate as well as enhancing safe mobility. Alongside the automotive sector – passenger cars and commercial vehicles – ZF also serves market segments such as construction and agricultural machinery, wind power, marine propulsion, rail drives and test systems. With some 168,700 employees worldwide, ZF reported sales of €46.6 billion in fiscal 2023. The company operates 162 production locations in 31 countries. Please find more information on: www.zf.com

Foxconn’s Investment helps Indigo accelerate its breakthrough Smart EVs with superior user experiences and sustainable unit economics for fleets, businesses and transportation companies Boston, MA --(BUSINESS WIRE)— March 25, 2024— Indigo Technologies, a robotics focused Smart EV OEM with breakthrough road sensing SmartWheels™ invented by team out of MIT, today announced it has received a strategic investment from Hon Hai Technology Group (Foxconn). The investment, which recently gained regulatory approval after being first announced late last year, accelerates Indigo, the US automotive tech innovator in its development of smart, smooth and efficient light utility EVs designed for sustainable ride hail, delivery and autonomous transportation services. Indigo EVs will help transportation network companies (TNC) and delivery network companies (DNC), fleet management companies (FMC) and the millions of businesses, taxi drivers and gig economy work force to become more profitable while driving to a more sustainable future. “Our cities, citizens and businesses need affordable and desirable EVs that improve safety, utility and comfort,” says Will Graylin, CEO of Indigo. “We are thrilled to be partnering with Foxconn on the mission to create technology for smart living and deliver the next generation of lighter, more cost effective EVs for sustainable mobility at scale. Foxconn’s Chief Strategy Officer for Electric Vehicles Mr. Jun Seki, who was former CEO of Nidec and COO of Nissan, joins Indigo’s Board of Directors adding further innovation depth and global supply chain connections as we launch vehicles in 2025”. According to Foxconn, this will support the vision to turn an MIT invention into a global innovation with commercial adoption.  Partnered with the largest TNCs, DNCs and FMCs, Indigo’s EV software and hardware solutions with TaaS Transport-as-a-Service package will include fleet transport operations and manage autonomous fleet mobility on public roads. Indigo invented the world’s only road sensing SmartWheels™, robotics hardware and software that fully integrates drivetrain and suspension as a tech package, to enable a whole new vehicle architecture, making lighter, more efficient EVs feel incredibly smooth and stable, yet more roomy and affordable. Indigo first SmartWheels™ powered EVs, the FLOW, will have more usable cabin space, a lower flat floor, a smoother ride experience and better unit economics than any vehicle of its class. The FLOW will have 180 cubic feet of space, approximately 200 miles of range, priced near $37K and is expected to hit the roads of America late 2026. Indigo will also deliver a smaller Smart EV called the DASH with the latest telematics and sensors connected to its cloud software to help fleets lower risks and total-cost-of-ownership while improving service experiences. The DASH will have 90 cubic feet of space, 140 miles of range, priced near $27K and will be in trial 2H 2024, with volume delivery early 2025.  About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking in the top 30 among the Fortune Global 500. In 2023, revenue totaled TWD6.162 trillion (approx. USD198 billion or EUR183 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and others. The Group operates 205 campuses across 24 countries and is one of the world’s largest employers with over a million employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – next-generation communications technology, AI, and semiconductors – which are key to driving its long-term growth strategy. It is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practices model for global enterprises. To learn more, visit www.honhai.com     About Indigo Tech Indigo is the only Smart EV OEM with patented road sensing robotic SmartWheels™ EVs with roomier, smoother and safer rides for people and fleets at a price they can afford. We are building a whole new class of ultra-efficient EVs designed from the wheels up focused on user experience and unit economics. Indigo Smart EVs are designed first for ride hail and delivery applications, and will expand later towards consumer Smart EVs with possibilities to license its technology to other OEMs.  Indigo SmartWheels™ powered EVs will have the largest interior space, smoothest and best ride quality, and lowest cost-per-mile of any vehicle in its class.        Indigo is working with fleets, TNCs, DNCs and Transportation-as-a-Service (TaaS) companies, to proliferate sustainable, desirable and affordable transportation for all. www.indigotech.com

Group’s first participation features groundbreaking autonomous driving research 19 March 2024, Taipei, Taiwan, and San Jose, California – Hon Hai Technology Group (“Foxconn”) (TWSE:2317), the world’s largest electronics manufacturing and service provider, today announced its participation at NVIDIA GTC, showcasing the Group’s robust expertise in AI solutions that span exclusive, state-of-the-art server systems, advanced driver assistance systems for intelligent electric vehicles and groundbreaking deep learning research for autonomous driving called “QCNet.” Foxconn Chairman and CEO Young Liu attended the NVIDIA GTC 2024 keynote, and personally witnessed the release of new AI server products. He thanked NVIDIA CEO Jensen Huang for his support at Hon Hai Tech Day in October last year. The presence of Foxconn’s team of around two dozen executives at the AI conference in San Jose, California, this year is a first for the Group, underscored its gold-level sponsorship of the event and emphasis on the importance of AI in its close collaboration with NVIDIA. As generative AI continues to sweep across industries, addressing the diverse computing demands of customers with the right AI data center infrastructure solutions has become the Group's top priority. Foxconn subsidiary Ingrasys Technology Inc is exhibiting a comprehensive, future-proof AI total solution powered by NVIDIA technology, empowering customers to build their ideal AI data centers. Ingrasys offers a broad portfolio of 1U/2U/4U NVIDIA MGX-based servers for a variety of use cases with a time-to-market advantage — providing a modular architecture to integrate current and future NVIDIA GPUs, CPUs, DPUs, and NVIDIA AI Enterprise software. An ideal choice for AI training workloads, Ingrasys’ newest AI accelerator, the GB6181, is designed to accommodate eight NVIDIA H100 Tensor Core GPUs or support next-generation GPUs, serving as the building block for high-performance AI data centers. Visitors will also have a chance to explore the ES2100, a 2U NVMe-oF storage system featuring the NVIDIA Spectrum-2 Ethernet switch to provide higher throughput for extreme networking performance. Its modular and innovative midplaneless design allows users to easily upgrade the system by replacing two switch modules. Now, to fuel a new wave of generative AI applications, Ingrasys is leveraging the NVIDIA GB200 NVL72, a next-generation AI liquid-cooled rack solution. It combines 36 NVIDIA GB200 Grace Blackwell Superchips, which include 72 NVIDIA Blackwell-based GPUs and 36 NVIDIA Grace CPUs interconnected by fifth-generation NVIDIA NVLink to act as a single massive GPU. “Our collaboration with NVIDIA helps us deliver the latest accelerated computing technologies to our customers so they can build AI-powered data centers to suit a wide range of applications,” said Benjamin Ting, President of Ingrasys. “Using the NVIDIA MGX platform, we’re able to adopt modular designs to quickly and cost-effectively build different server configurations and reduce time to market.” “Foxconn offers a diverse product lineup powered by NVIDIA accelerated computing that addresses the unique requirements of different industries using the NVIDIA MGX modular reference server architecture,” said Kaustubh Sanghani, vice president of GPU product management at NVIDIA. “Through its support of NVIDIA Blackwell architecture-based processors, networking and software, Ingrasys will help fuel generative AI and accelerated computing with its next-generation systems.” Complementing Ingrasys’ rack solution is an advanced liquid-cooling solution, including liquid-to-air side car and liquid-to-liquid CDU solutions, with a robust cooling capacity up to 1300kW. These solutions are both powerful and energy-efficient, perfectly suited for cooling the next-generation AI infrastructure. In addition to the data center infrastructure solution, in the field of autonomous driving, the Group is exhibiting the Smart Drive intelligent driving controller based on the NVIDIA Orin X processor, demonstrating Foxconn’s diverse solutions in the field of ADAS hardware. According to different product positioning, ADAS controllers are provided in three levels: Basic, Advanced and Premium. Among them, the Premium level is equipped with two Orin NX processors, which can support even the most challenging computing power requirements. Equipped with water-cooling heat dissipation technology, it provides a stable and efficient operating environment for the system and ensures consistent product performance. Presented at one of its first public forums, Dr Yung-Hui Li, Director of the Artificial Intelligence Research Center at Hon Hai Research Institute, shared “QCNet: Query-Centric Trajectory Prediction for Autonomous Driving,” a neural architecture that aims to increase driving safety by overcoming some important challenges in predicting where other cars and pedestrians will travel. The deep learning model “QCNet” technology being developed by Foxconn and City University of Hong Kong exhibits unprecedented performance on large-scale trajectory prediction datasets. It has been ranked as the champion on the leaderboard of Argoverse2 Motion Forecasting Competition since 9 months ago. Considering the extremely fierce competitive landscape in the field of autonomous driving technology, this is a highly remarkable achievement and demonstrates the effectiveness of the Group’s designs and its technological leadership in AI. At GTC, Foxconn is located in the San Jose McEnery Convention Center exhibit hall in the Industrial Digitalization Pavilion at Booth 538. More information on the exhibit hall and hours can be found here. About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking in the top 30 among the Fortune Global 500. In 2022, revenue totaled TWD6.62 trillion (approx. USD222 billion or EUR200 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and others. The Group operates 205 campuses across 24 countries and is one of the world’s largest employers with over a million employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – next-generation communications technology, AI, and semiconductors – which are key to driving its long-term growth strategy. It is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practices model for global enterprises. To learn more, visit www.honhai.com

Durham, NC (January 16, 2024) – Open Invention Network (OIN), the organization formed to safeguard open source and now the largest patent non-aggression community in history, announced today that Hon Hai Technology Group (Foxconn) has joined as a community member. As a leading technological solution provider and the world’s largest electronics manufacturer, Foxconn is reinforcing its commitment to open source. “Advances in design and manufacturing propel ongoing innovation within the electronics and components industries. A key driver of these new capabilities is open source technology. Open source enables companies to share foundational technology while they invest in powerful, differentiating features and capabilities higher in the technology stack,” said Keith Bergelt, CEO of Open Invention Network. “As a global leader in the development and manufacturing of electronics and technology solutions, we are pleased that Foxconn is committed to patent non-aggression in open source.” “Foxconn continuously looks for ways to integrate advances into the design and manufacturing of smart consumer electronics, cloud and networking equipment, computing devices and components, among others,” said Mick Lim, Director of Foxconn IP Affairs Division. “We are pleased to join the Open Invention Network and support its role in protecting open source.” As a community, OIN members practice patent non-aggression in core Linux and adjacent open source technologies by cross-licensing Linux System patents to one another on a royalty-free basis. The membership form and the OIN license agreement can be signed online at http://www.j-oin.net/   About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking in the top 30 among the Fortune Global 500. In 2022, revenue totaled TWD6.62 trillion (approx. USD220 billion or EUR200 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and others. The Group operates 173 campuses across 24 countries and is one of the world’s largest employers with over a million employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – next-generation communications technology, AI, and semiconductors – which are key to driving its long-term growth strategy. It is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practices model for global enterprises. To learn more, visit www.honhai.com   About Open Invention Network Open Invention Network (OIN) is the largest patent non-aggression community in history and supports freedom of action in Linux as a key element of open source software (OSS). Patent non-aggression in core technologies is a cultural norm within OSS. The litmus test for authentic behavior in the OSS community includes OIN membership. Funded by Google, IBM, NEC, Philips, Sony, SUSE, and Toyota, OIN has more than 3,800 community members. The OIN patent license and member cross-licenses are available royalty-free to any party that joins the OIN community. For more information, please visit www.openinventionnetwork.com.

Foxconn and Porotech form partnership to expedite the commercialization of MicroLED Microdisplays for augmented reality (AR) applications aiming to establish world’s first complete end-to-end, viable supply chain. 【2023.12.15 Taipei】 Hon Hai Technology Group (“Foxconn”) (TWSE: 2317), the world's largest electronics manufacturer and technology service provider, and Poro Technologies Ltd (“Porotech”), a pioneer in GaN-based semiconductor technology and a global fabless MicroLED company, announce a strategic partnership in MicroLED Microdisplays for augmented reality (AR) applications. This partnership will assemble Foxconn’s proprietary technologies in semiconductor wafer manufacturing, packaging, IC drivers, CMOS backplanes, module assembly, system assembly and Porotech’s world leading technologies in PoroGaN® MicroLEDon-Silicon (uLEDoS), Dynamic Pixel Tuning® (DPT®), GaN-on-Silicon platform. The end product will target ultra-high-density and energy efficient MicroLED Microdisplays for AR applications, wearable, and smart devices. The microLED device for AR applications has great potential, but at the same time is quite challenging. It involves multiple disciplines including semiconductor wafer manufacturing, hybrid bond, IC design, optoelectronics, quantum physics, and optics. Integration across these different fields is difficult and progress has been slow. In the past, no single company possesses such a big portfolio of expertise. With this partnership, we expect to expedite the research and productization of MicroLED technology and push the AR application to a new era. Foxconn's strength in supply chain management is also expected to contribute at the mass production stage. Foxconn and Porotech share the vision and goal of MicroLED Microdisplay technology for AR applications. Both parties are enthusiastic about the potential outcomes of this collaboration to reshape the AR landscape. Dr Bob Chen, GM of Foxconn’s semiconductor business group, commented: “Our strategic alliance with Porotech will accelerate development of MicroLED Microdisplays. It is one step closer to tapping into the tremendous opportunities that AR can bring to the world. We are excited to collaborate with Porotech to integrate many technologies from different fields.” Dr Tongtong Zhu, Chief Executive Officer and Founder of Porotech, added: “Our collaboration with Foxconn signifies a momentous step forward for MicroLED Microdisplays and AR. This strategic partnership speaks volumes about our shared dedication to innovation and excellence. GaN on Silicon's role in uLEDoS tech advancement is undeniable. An exciting road lies ahead with Foxconn, propelling MicroLED Microdisplays with our mutual partners and customers with collective triumph and significant growth in the MicroLED revolution!”   About Hon Hai Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking in the top 30 among the Fortune Global 500. In 2022, revenue totaled TWD6.62 trillion (approx. USD220 billion or EUR200 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and others. The Group operates 173 campuses across 24 countries and is one of the world’s largest employers with over a million employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – nextgeneration communications technology, AI, and semiconductors – which are key to driving its long-term growth strategy. It is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practices model for global enterprises. For more information, visit www.honhai.com   ABOUT POROTECH Porotech Technologies Ltd is a trailblazer in MicroLED and gallium nitride (GaN) material technology, headquartered in Cambridge (UK), with R&D Centre in Hsinchu (Taiwan) and sales office in Chandler, Arizona (USA). Focused on pioneering advancements in display technology, Porotech's pioneering PoroGaN® platform drives the development of ultra-small and efficient MicroLED chips. These chips are capable of emitting the full visible spectrum of colours using a single GaN material system. The company's breakthrough Dynamic Pixel Tuning® (DPT®) technology further enhances display capabilities, enabling MicroLED pixels to emit any visible colour at specific current densities. Porotech is committed to shaping the future of displays, offering unmatched brightness, energy efficiency, and vibrant colour solutions. For more information, visit: www.porotech.com

What’s new: NXP® Semiconductors and Hon Hai Technology Group (“Foxconn”) today opened a joint laboratory in the Foxconn Nankan Facility in Taiwan, marking a new milestone in the companies’ strategic collaboration for software-defined electric vehicle development. The joint lab aims to accelerate Foxconn’s efforts in software-defined, electric vehicles, leveraging NXP’s comprehensive electrification portfolio and cross-vehicle system solutions using the S32G and S32K3 families for domain and zonal controllers targeting service-oriented gateways, vehicle networking and safe vehicle control. Why it matters: According to McKinsey & Company, the global automotive software and electronics market is expected to reach $462 billion by 2030, representing a 5.5 percent compound annual growth rate (CAGR) since 2019. The way vehicles are architected, designed, manufactured and experienced is being transformed by software, but this transformation will be an industry-wide effort, requiring close collaboration between diverse stakeholders. The joint laboratory in Taoyuan is a significant example of this team effort. It benefits from bringing together Foxconn’s deep knowledge and experience in electronics manufacturing with NXP’s longstanding expertise in safe and secure system solutions to enable architectural innovation and platforms for electrification, connectivity, and safe automated driving. Together, the companies aim to accelerate the development time for software-defined electric vehicles. More details: In July 2022, NXP announced that it had signed a memorandum of understanding with Foxconn to jointly develop platforms for a new generation of smart connected vehicles, aiming to leverage NXP’s portfolio of automotive technologies. The joint laboratory in Foxconn’s Nankan facility will be the primary location for innovation, discussion, training and enabling new applications. The collaborative lab brings together more than 200 engineers based locally and abroad from both Foxconn and NXP.  “Foxconn sees the disruptive challenges and the potential for innovation in today’s automotive industry. NXP’s longstanding expertise and leadership in the automotive sector, system understanding, innovative products and laser focus on safety, security and quality provide the foundation for the collaboration we are strengthening today,” said Zeke Wu, EV E/EA R&D Director, Foxconn E-Business Group. ”The joint lab is a significant milestone in the strategic partnership between Foxconn and NXP and we anticipate the results will be adopted in Foxconn’s future developments.” Elton Tsang, Senior Sales Director of NXP Semiconductors Taiwan commented: “We are proud to see the strategic collaboration has moved to the next milestone with the establishment of a joint lab with Foxconn today. The lab will accelerate the progress of electric, software-defined vehicles from talk to reality. The auto industry has to become faster and more efficient, and NXP is pleased to extend its system solutions portfolio to enable electrification, next generation architectures, smart and secure car access systems, and more.”

＊BTQ Technologies Corp. announces that its wholly owned subsidiary, BTQ AG, has entered into a Research and Collaboration Agreement with Hon Hai Research Institute. ＊Deepening two-year collaboration, work aims to support academic community in promoting standardization of PQC. ＊In response to call for PQC standard solicitation by U.S. National Institute of Standards and Technology (NIST), BTQ and Hon Hai Research Institute’s collaborative report was co-published in July, demonstrating their combined expertise and commitment to advancing post-quantum cryptography standards.   【VANCOUVER, TAIPEI, November 29, 2023】 -- BTQ Technologies Corp., a leading quantum technology company focused on securing mission-critical networks, is pleased to announce that, together with its wholly-owned unit BTQ AG, has entered into a Research and Collaboration Agreement (the “Agreement” or “Research Program”) with Hon Hai Research Institute, a key think tank for Hon Hai Technology Group (Foxconn), the world’s largest electronics manufacturer and a leading technological solution provider. The goal of the collaboration is to promote the standardization of post-quantum cryptography. The collaboration between BTQ and Hon Hai Research Institute began two years ago and the efforts in PQC led to the submission of a milestone report under the Research Program to the US National Institute of Standards and Technology (NIST) on June 1, 2023. It addressed the "Call for Additional Digital Signature Schemes for the Post-Quantum Cryptography Standardization Process" and the co-authored report was formally published in July this year. NIST launched the PQC standardization project in 2016, hoping to establish a complete encryption and decryption system and digital signature system, which will become a new generation of standardized cryptography systems. The significance of the recent publication is that its findings could have the opportunity to be adopted by government and industry in the future and become one of the reference standards for future development. NIST is expected to announce the final version in 2024. The contribution of Hon Hai Research Institute represents the forward-thinking direction in the field of post-quantum cryptography, which is in line with the trend of international academic research. The work to date is a great affirmation for BTQ and HHRI in jointly promoting research in this particular field. It sets a stronger foundation for the Research Program and the deepening partnership. “We are pleased to have entered into this Agreement with Foxconn, a truly world-class and global organization at the forefront of cutting edge technological innovation,” said BTQ CEO Olivier Roussy Newton. “This contract strengthens our relationship with a long-term strategic partner and is a great testament as to the quality of the scientific team BTQ has assembled to date. Additionally, Foxconn has demonstrated interest in the Canadian deep technology talent pool which opens the door to opportunities for various collaborations long-term. We look forward to building upon this relationship and bringing meaningful developments to the quantum industry” “This partnership not only strengthens our relationship with BTQ, a dynamic and forward-thinking company, but also underscores the caliber of our scientific team and their dedication to advancing the field of post-quantum cryptography,” said Hon Hai Research Institute CEO Wei-bin Lee. “Our recent participation in the NIST PQC submission demonstrates the significant contributions we have already made to the advancement of PQC. We look forward to a fruitful collaboration that will drive progress in the field.”   NIST PQC Standardization In response to the significant progress and development in quantum computing, The National Institute of Standards and Technology (NIST) launched a public process to identify quantum-resistant public-key cryptographic algorithms for standardization. The process began with a public call for submissions to the post quantum cryptography (PQC) Standardization Process in December 2016. After three rounds of evaluation and analysis over several years, NIST announced the first set of algorithms to be standardized in 2022. This marked an important step towards ensuring the security of digital infrastructure against the growing threat posed by quantum computing. Now, NIST is continuing the PQC standardization process with a fourth round, in which NIST is calling for additional digital signature proposals to be considered in the PQC standardization process. About BTQ BTQ was founded by a group of post-quantum cryptographers with an interest in addressing the urgent security threat posed by large-scale universal quantum computers. With the support of leading research institutes and universities, BTQ is combining software and hardware to safeguard critical networks using unique post-quantum services and solutions. Connect with BTQ: Website | LinkedIn About Hon Hai Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking in the top 30 among the Fortune Global 500. In 2022, revenue totaled TWD6.62 trillion (approx. USD220 billion or EUR200 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and others. The Group operates 173 campuses across 24 countries and is one of the world’s largest employers with over a million employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – next-generation communications technology, AI, and semiconductors – which are key to driving its long-term growth strategy. It is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practices model for global enterprises. To learn more, visit www.honhai.com About Hon Hai Research Institute The establishment of the Hon Hai Research Institute is an important step in the Group’s development strategy as it moves one step closer to its “Foxconn 3.0” transformation. The Institute has five research centers and one laboratory. Each center has an average of 40 high technology R&D professionals, all of whom are focused on the research and development of new technologies; the strengthening of Foxconn’s technology and product innovation pipeline; efforts to support the Group’s transformation from “brawn” to “brains”; and the enhancement of the competitiveness of Foxconn’s “3+3” strategy.

 ＊Exolaunch adds a new APAC customer to its rapidly diversifying portfolio  ＊Exolaunch will provide mission management, deployment hardware, and services for Foxconn’s inaugural set of satellites  ＊The satellites will launch onboard SpaceX’s Falcon 9 on the Transporter-9 mission, no earlier than November 2023 Berlin, Germany/Taipei, Taiwan – November 6, 2023 – Exolaunch (“Exolaunch” or “the Company”) has signed a launch services agreement (LSA) with the Hon Hai Technology Group (“Foxconn”) to provide mission management, orbital deployment hardware and services for Foxconn’s first ever satellites. Exolaunch is a global provider of small satellite mission management and deployment services, having deployed over 320 satellites into orbit using its proprietary deployment technologies on the most frequent and reliable launch vehicles on the market. As with past integrations and deployments for A-list constellation providers like Spire Global, ICEYE, and others, Exolaunch will play an integral role in Foxconn's long-term success in space. The satellites, named PEARL-1H and PEARL-1C, are scheduled to launch on SpaceX’s Falcon 9 via Exolaunch, during the Transporter-9 mission from Space Launch Complex 4E (SLC-4E) at Vandenberg Space Force Base in California no earlier than November 2023. Along with end-to-end mission management, integration, and deployment services, Exolaunch is providing Foxconn with its record-setting EXOpod Nova deployer.   "This latest LSA with Foxconn comes at a watershed moment for Exolaunch, as we are broadening our team and capabilities within the launch service industry globally," said Jeanne Allarie, Chief Commercial Officer (CCO) - Exolaunch. "Exolaunch has worked directly with customers over the last ten years listening closely to the needs of cutting-edge satellite industry players. Supporting a company as widely known and depended on as Foxconn is an honor and culmination of this hard work." “This is a pilot run as proof of the concept for our efforts in LEO satellite broadband communications and next-gen, beyond 5G (B5G) capabilities. It is also a great example of collaboration between academia and industry. Exolaunch plays a crucial role in getting our mission to space,” said Dr Jen-Ming Wu, Director of the Next-generation Communications Research Center at Hon Hai Research Institute. “In the B5G and new space era, the launch of LEO satellites will become ever more cost-competitive and convenient. Foxconn’s first PEARL is meant to show we will be ready to meet the increase in demand for key components, sub-system, and assembly integration test, driving higher circulation and innovation in the new space industry,” said Jesse Chao Sr. Director, B5G Policy, Corporate Policy.   About Exolaunch Exolaunch (Germany, USA) is the fastest-growing provider of rideshare launch services and in-space logistics products and services for the NewSpace industry. With a decade of flight heritage and over 320 satellites launched across 23 missions (as of November 2023), Exolaunch leverages industry insight to tailor turnkey solutions that meet customer needs and respond to market trends. Exolaunch fulfills launch contracts for NewSpace industry leaders, the world's most innovative start-ups, research institutions, government organizations, and space agencies around the world. The company develops and manufactures its own flight-proven and industry-leading small satellite separation systems, with the fastest growing heritage on the market. Exolaunch is also developing Reliant, a line of environmentally friendly orbital transfer vehicles (OTVs), for last-mile satellite delivery, in-space logistics, and space debris removal. Exolaunch is committed to making space accessible and promoting its safe, sustainable, and responsible use. For more information, please visit www.exolaunch.com or reach out at info@exolaunch.com For media inquiries, please contact media@exolaunch.com   About Hon Hai Technology Group (Foxconn) Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking in the top 30 among the Fortune Global 500. In 2022, revenue totaled TWD6.62 trillion (approx. USD220 billion or EUR200 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and others. The Group operates 173 campuses across 24 countries and is one of the world’s largest employers with over a million employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – new-generation communications technology, AI, and semiconductors – which are key to driving its long-term growth strategy. It is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practices model for global enterprises. To learn more, visit www.honhai.com