10G multi-gigabit Automotive Ethernet link to be demonstrated over a 15-meter cable using Broadcom PHY technology.

Santa Clara, Calif., January 29, 2024 -- Foxconn Interconnect Technology (6088.HK) (“FIT”), a leading connective solution provider creating powerful connections for a better world, today announced the demonstration of its 10G multi-gigabit Automotive Ethernet cable and connector solutions at the DesignCon 2024 exhibition in Santa Clara, California from January 30th to February 1st.

FIT’s FoxNet GII Multi-Gig Automotive Ethernet Connector and Cable will appear together with Broadcom’s 10G PHY Automotive Ethernet Evaluation Board. This demo will feature Broadcom’s BCM89890 multi-gigabit Automotive Ethernet PHY chip, connected with FIT’s 15-meter Foxnet GII Multi-Gig Cable, which includes 4 in-line connectors. This cable link supports the IEEE 802.3ch specification which is rated for 2.5, 5 and 10 Gbps for Automotive Ethernet applications and compliant with OPEN Alliance TC9 standard for Single Pair Ethernet (SPE). The IEEE 802.3ch specification also identifies a maximum length 15-meter cable assembly, with up to 4 in-line connectors.

FIT’s FoxNet GII connector and cable family includes (1) Single Port Configuration (as shown in the demo), (2) In-Line Connector Configuration (as shown in the demo), (3) 2x2 (4 port) Connector Configuration, and (4) 1x2 (2port) Connector Configuration. FIT will be conducting a live demonstration of its 10G multi-gigabit Automotive Ethernet link over a 15-meter cable assembly in the FIT Booth #619. This live demo will continuously monitor the bit error rate (BER) across the 15-meter cable length (with 4 in-lines), sending and receiving packets of data continuously.

Applications:
‧ Domain Controller, Gateway (Zonal Architecture)
‧ Advanced Driver Assistance Systems
‧ 4D Radar
‧ Lidar
‧ High-resolution 4K Displays
‧ Rear Seat Entertainment
‧ 4K Camera Systems
‧ Intelligent Headlight

Protocols Supported:
‧ 100BASE-T1
  1000BASE-T1
  Multi-Gigabit (2.5, 5 and 10 Gbps ,IEEE 802.3ch)
‧ Beyond 10 Gbps (IEEE 802.3cy)
‧ PCIe (to be optimized), LVDS SerDes (FPD Link, GMSL, Motion Link, MIPI PHYs, HSMT)

About FIT Hon Teng
Foxconn Interconnect Technology (FIT) is a leading global solutions developer and manufacturer, cultivating connectivity for a better world. With unsurpassed capabilities in development, research, manufacturing engineering and design, production, supply chain, and go-to-market planning for world class brands and private label products spanning B2C and B2B categories, FIT is at the forefront of worldwide technological trends delivering compelling user experiences at scale. With offices and manufacturing sites located in Asia, the Americas and Europe, FIT is a global leader in the manufacturing of high precision interconnect components. For more information, visit FIT’s website: https://www.fit-foxconn.com.