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Foxconn Technology Group debuts 5G innovations at IEEE GLOBECOMM 2020
2020/12/07
Industry Events

December 8, 2020, Taiwan - Foxconn Technology Group today made its debut at IEEE GLOBECOMM 2020, the flagship conference of the IEEE Communications Society, in Taiwan, showcasing its latest 5G software and hardware innovations and capabilities. At the exhibition, Foxconn presented its O-RAN Small Cell equipment and demonstrated how they leverage their 5G infrastructure to deploy an end-to-end 5G commercial network. Committed to creating a connected world with smart technologies, the company gave a preview of their 5G blueprint, which outlined how the industry will develop in the coming years.

Industry leading 5G technologies

Aligning with the conference theme of “Communications for Human and Machine Intelligence”, the company demonstrated its commitment towards the development of future technologies, with its proprietary 5G infrastructure. In preparation for the 5G era, Foxconn has been investing in the development of O-RAN and its associated components for their 5G infrastructure.

With these developments, Foxconn is setting a new industry benchmark with its O-RAN Small Cell, providing high-speed 4T4R (4 Transmit 4 Receive) transmission that is fully compliant with high standard O-RAN solutions and production requirements. This will ultimately enable 5G network equipment providers to better deploy Small Cell solutions in indoor environments. 

At the event, Foxconn also conducted a live demo to show how the company leverages the 5G infrastructure, with its low latency and fast download speeds of 1Gbps, to meet the commercial requirements of customers. Foxconn has also partnered with industry-leading customers to deepen their collaboration on the 5G O-RAN platform, to enable the development of the open RRU (Remote Radio Unit). All associated products are available for commercial-use and will be accredited with global certifications later this month.

At the exhibition, Foxconn will demonstrate how the company leverages the 5G infrastructure, with its low latency and fast download speeds of 1Gbps, to meet the commercial needs of customers. Foxconn has also partnered with industry-leading customers to deepen their collaboration on the 5G O-RAN platform, to enable the development of the open RRU (Remote Radio Unit). All associated products are available for commercial-use and will be accredited with global certifications in Q4 this year.

5G and industrial intelligence in smart manufacturing

Apart from building a 5G infrastructure, Foxconn is one of the pioneers in deploying 5G commercial networks. To address various demand from customers on smart manufacturing, Foxconn adopted a three-pronged approach to smart manufacturing that includes: Business, Management, and Facility.

In the Facility aspect, with 5G-based industrial IOT and TSN-enabled networks, the data generated from various industrial equipment and sensors will help inform the control system of the operation that will ultimately bring high efficiency and flexibility.

Dr. Jay Lee, Vice Chairman at Foxconn Technology Group, attended the conference virtually and delivered a keynote speech on the theme of “Industrial AI For Smart Digital Transformation”. In his speech, he shared his views on how to apply 5G, AI, IoT and other emerging technologies in smart manufacturing to enhance industrial transformation.

“A leading technology solutions provider, Foxconn prides itself on continuous innovation with a focus on future technologies that include 5G and AI. The ultimate goal of an industrial intelligence system is to provide a worry-free environment that can constantly predict and optimize performance.”, said Dr. Lee.

The Hon Hai Research Institute also used the conference to outline its innovative technology research projects focused on the development of the core of future technology. The 5G-related research areas for its three research institutes, next-generation communications, cybersecurity and quantum computing, focus on: new chip designs (automotive semiconductor hardware security), new materials development (new materials for millimeter wave transmitters), new software design (Based on Open-RAN, access to software architecture design) and new computing design (research on applying quantum computing on 5G platform to enhance the accessibility).

Foxconn Technology Group is showcasing its products and solutions at booth B01 and B02 in Room 101, the Taipei International Convention Center (TICC). For more information, please refer to the attached brochure or visit the website https://globecom2020.ieee-globecom.org/
 

 

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